Search results for "3D die stacking"

Found 12 publication records. Showing 12 according to the selection in the facets

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
2	Gabriel H. Loh, Yuan Xie, Bryan Black	Processor Design in 3D Die-Stacking Technologies.	IEEE Micro	2007	DBLP DOI BibTeX RDF	processor architectures, computer systems organization, 3D integration
2	Niti Madan, Rajeev Balasubramonian	Leveraging 3D Technology for Improved Reliability.	MICRO	2007	DBLP DOI BibTeX RDF	redundant multi-threading, 3D die-stacking, dynamic timing errors, power-efficient microarchitecture, on-chip temperature, reliability, soft errors, parameter variation
1	Dongki Kim, Sungjoo Yoo, Sunggu Lee, Jung Ho Ahn, Hyunuk Jung	A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC.	DATE	2011	DBLP BibTeX RDF
1	Yibo Chen, Jishen Zhao, Yuan Xie	3D-nonFAR: three-dimensional non-volatile FPGA architecture using phase change memory.	ISLPED	2010	DBLP DOI BibTeX RDF	non-volatile FPGA, phase-change memory, 3D IC
1	Dean L. Lewis, Sudhakar Yalamanchili, Hsien-Hsin S. Lee	High Performance Non-blocking Switch Design in 3D Die-Stacking Technology.	ISVLSI	2009	DBLP DOI BibTeX RDF
1	Wangyuan Zhang, Tao Li	Exploring Phase Change Memory and 3D Die-Stacking for Power/Thermal Friendly, Fast and Durable Memory Architectures.	PACT	2009	DBLP DOI BibTeX RDF
1	Bo Zhao, Yu Du, Youtao Zhang, Jun Yang 0002	Variation-tolerant non-uniform 3D cache management in die stacked multicore processor.	MICRO	2009	DBLP DOI BibTeX RDF	3D die stacking, NUCA, process variation, DRAM
1	Chang-Burm Cho, Wangyuan Zhang, Tao Li	Thermal Design Space Exploration of 3D Die Stacked Multi-core Processors Using Geospatial-Based Predictive Models.	SPEC Benchmark Workshop	2009	DBLP DOI BibTeX RDF	Thermal/power characterization, 3D die stacking, analytical modeling, multi-core architecture
1	Wangyuan Zhang, Tao Li	Microarchitecture soft error vulnerability characterization and mitigation under 3D integration technology.	MICRO	2008	DBLP DOI BibTeX RDF
1	Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Pat Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb	Die Stacking (3D) Microarchitecture.	MICRO	2006	DBLP DOI BibTeX RDF
1	Yangdong Steve Deng, Wojciech Maly	2.5D system integration: a design driven system implementation schema.	ASP-DAC	2004	DBLP DOI BibTeX RDF	2.5D System Integration, 3D stacking, 3D-IC
1	Bryan Black, Donald Nelson, Clair Webb, Nick Samra	3D Processing Technology and Its Impact on iA32 Microprocessors.	ICCD	2004	DBLP DOI BibTeX RDF