|
|
|
|
Venues (Conferences, Journals, ...)
|
|
|
GrowBag graphs for keyword ? (Num. hits/coverage)
Group by:
No Growbag Graphs found.
|
|
|
|
|
Results
Found 9 publication records. Showing 9 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, David Atienza |
Neural Network-Based Thermal Simulation of Integrated Circuits on GPUs.  |
IEEE Trans. on CAD of Integrated Circuits and Systems  |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza |
Accelerating thermal simulations of 3D ICs with liquid cooling using neural networks. |
ACM Great Lakes Symposium on VLSI |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | David Atienza, Arvind Sridhar |
Tutorial T7A: New Modeling Methodologies for Thermal Analysis of 3D ICs and Advanced Cooling Technologies of the Future. |
VLSI Design |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Mohamed M. Sabry, Arvind Sridhar, David Atienza |
Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation. |
DATE |
2012 |
DBLP BibTeX RDF |
|
| 1 | Alessandro Vincenzi, Arvind Sridhar, Martino Ruggiero, David Atienza |
Fast thermal simulation of 2D/3D integrated circuits exploiting neural networks and GPUs. |
ISLPED |
2011 |
DBLP BibTeX RDF |
|
| 1 | Mohamed M. Sabry, Arvind Sridhar, David Atienza, Yuksel Temiz, Yusuf Leblebici, S. Szczukiewicz, N. Borhani, J. R. Thome, Thomas Brunschwiler, Bruno Michel |
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling. |
DATE |
2011 |
DBLP BibTeX RDF |
|
| 1 | José L. Ayala, Arvind Sridhar, David Cuesta |
Thermal modeling and analysis of 3D multi-processor chips. |
Integration |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza |
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling. |
ICCAD |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | José L. Ayala, Arvind Sridhar, Vinod Pangracious, David Atienza, Yusuf Leblebici |
Through Silicon Via-Based Grid for Thermal Control in 3D Chips. |
NanoNet |
2009 |
DBLP DOI BibTeX RDF |
|
Displaying result #1 - #9 of 9 (100 per page; Change: )
|
|
![[Valid RSS]](Pics/valid-rss.png "Validate my RSS feed")