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Found 6 publication records. Showing 6 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer 0002, Bernd Michel |
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling.  |
Microelectronics Reliability  |
2011 |
DBLP DOI BibTeX RDF |
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| 1 | Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer 0002, H. Walter, Q. Shaik, K. Rätzke, F. Faupel, Bernd Michel, Herbert Reichl |
Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
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| 1 | Rainer Dudek, Ralf Doering, Christine Bombach, Bernd Michel |
Simulation based analysis of secondary effects on solder fatigue. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
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| 1 | M. Spraul, W. Nüchter, A. Möller, Bernhard Wunderle, Bernd Michel |
Reliability of SnPb and Pb-free flip-chips under different test conditions. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
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| 1 | Mike Roellig, Rainer Dudek, Steffen Wiese, Bjoern Boehme, Bernhard Wunderle, Klaus-Jürgen Wolter, Bernd Michel |
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
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| 1 | Bernhard Wunderle, Bernd Michel |
Progress in reliability research in the micro and nano region. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
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Displaying result #1 - #6 of 6 (100 per page; Change: )
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