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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 1 occurrences of 1 keywords
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Results
Found 23 publication records. Showing 23 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Feifei He, Cher Ming Tan |
Electromigration reliability of interconnections in RF low noise amplifier circuit.  |
Microelectronics Reliability  |
2012 |
DBLP DOI BibTeX RDF |
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| 1 | Feifei He, Cher Ming Tan |
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
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| 1 | Feifei He, Cher Ming Tan |
Circuit level interconnect reliability study using 3D circuit model. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
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| 1 | Y. C. Tan, Cher Ming Tan, Xiaowu Zhang, Tai Chong Chai, D. Q. Yu |
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
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| 1 | Cher Ming Tan, Boon Khai Eric Chen, Kok Peng Toh |
Humidity study of a-Si PV cell. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
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| 1 | Arijit Roy, Yuejin Hou, Cher Ming Tan |
Electromigration in width transition copper interconnect. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
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| 1 | Jie Liao, Cher Ming Tan, Geert Spierings |
Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI). |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
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| 1 | Cher Ming Tan, Boon Khai Eric Chen, Gan Xu, Yuanjie Liu |
Analysis of humidity effects on the degradation of high-power white LEDs. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
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| 1 | Guangyu Huang, Cher Ming Tan |
Reverse Breakdown Voltage Measurement for Power P+NN+ Rectifier. |
J. Electronic Testing |
2008 |
DBLP DOI BibTeX RDF |
Forced voltage test, Forced current test, PIV test, Minimum required test time, Destruction during test |
| 1 | Wei Li, Cher Ming Tan |
Enhanced finite element modelling of Cu electromigration using ANSYS and matlab. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
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| 1 | Arijit Roy, Cher Ming Tan, Sean J. O'Shea, Kedar Hippalgaonkar, Wulf Hofbauer |
Room temperature observation of point defect on gold surface using thermovoltage mapping. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
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| 1 | Cher Ming Tan, Stanny Yanuar, Tai Chong Chai |
Finite element modeling of capacitive coupling voltage contrast. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
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| 1 | Cher Ming Tan, Nagarajan Raghavan |
An approach to statistical analysis of gate oxide breakdown mechanisms. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
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| 1 | Cher Ming Tan, Zhenghao Gan, Tai Chong Chai |
Feasibility study of the application of voltage contrast to printed circuit board. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
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| 1 | Arijit Roy, Cher Ming Tan |
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Cher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low |
Development of highly accelerated electromigration test. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
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| 1 | Guangyu Huang, Cher Ming Tan |
Device level electrical-thermal-stress coupled-field modeling. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
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| 1 | Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen |
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. |
Microelectronics Reliability |
2005 |
DBLP DOI BibTeX RDF |
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| 1 | Cher Ming Tan, Joe Chiu, Robert Liu, Guan Zhang |
Reliability screening through electrical testing for press-fit alternator power diode in automotive application. |
Microelectronics Reliability |
2005 |
DBLP DOI BibTeX RDF |
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| 1 | Cher Ming Tan, Zhenghao Gan, Wai Fung Ho, Sam Chen, Robert Liu |
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications. |
Microelectronics Reliability |
2005 |
DBLP DOI BibTeX RDF |
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| 1 | Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim |
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. |
Microelectronics Reliability |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | Cher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low |
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects. |
Microelectronics Reliability |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | Cher Ming Tan, Kelvin Ngan Chong Yeo |
A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT). |
J. Electronic Testing |
2001 |
DBLP DOI BibTeX RDF |
electromigration testing, accelerated stress testing, reliability statistics, wafer-level reliability, SWEAT |
Displaying result #1 - #23 of 23 (100 per page; Change: )
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