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Publications of "Dali Mao" ( http://dblp.L3S.de/Authors/Dali_Mao )

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Publication years (Num. hits)
2011 (1) 2012 (2)
Publication types (Num. hits)
article(3)
Venues (Conferences, Journals, ...)
Microelectronics Reliability(3)
Authors
Dali Mao(3) Ming Li(3) Anmin Hu(2) Jing Hu(2) Tingbi Luo(2) Jinglin Bi(1) Mingzhi Ni(1)
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Found 3 publication records. Showing 3 according to the selection in the facets
Hits ?▲ Authors Title Venue Year Link Author keywords
1Mingzhi Ni, Ming Li, Dali Mao Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2012 DBLP  DOI  BibTeX  RDF
1Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2012 DBLP  DOI  BibTeX  RDF
1Jinglin Bi, Anmin Hu, Jing Hu, Tingbi Luo, Ming Li, Dali Mao Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2011 DBLP  DOI  BibTeX  RDF
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