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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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Found 3 publication records. Showing 3 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | C. S. Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong |
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement.  |
Microelectronics Reliability  |
2012 |
DBLP DOI BibTeX RDF |
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| 1 | Lan Peng, Hongyu Li, Dau Fatt Lim, Riko I. Made, Guo-Qiang Lo, Dim-Lee Kwong, Chuan Seng Tan |
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement. |
3DIC |
2010 |
DBLP DOI BibTeX RDF |
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| 1 | Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan |
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. |
3DIC |
2009 |
DBLP DOI BibTeX RDF |
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