|
|
|
|
Venues (Conferences, Journals, ...)
|
|
|
GrowBag graphs for keyword ? (Num. hits/coverage)
Group by:
No Growbag Graphs found.
|
|
|
|
|
Results
Found 11 publication records. Showing 11 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman |
An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects.  |
J. Solid-State Circuits  |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Paul W. Coteus, John U. Knickerbocker, Chung H. Lam, Yurii A. Vlasov |
Technologies for exascale systems. |
IBM Journal of Research and Development |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker |
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections. |
IBM Journal of Research and Development |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker |
3D chip stacking with C4 technology. |
IBM Journal of Research and Development |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | John U. Knickerbocker |
Preface. |
IBM Journal of Research and Development |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker |
Thermomechanical modeling of 3D electronic packages. |
IBM Journal of Research and Development |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright |
Three-dimensional silicon integration. |
IBM Journal of Research and Development |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang |
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection. |
IBM Journal of Research and Development |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | John U. Knickerbocker, Frank L. Pompeo, Alice F. Tai, Donald L. Thomas, Roger D. Weekly, Michael G. Nealon, Harvey C. Hamel, Anand Haridass, James N. Humenik, Richard A. Shelleman, Srinivasa N. Reddy, Kevin M. Prettyman, Benjamin V. Fasano, Sudipta K. Ray, Thomas E. Lombardi, Kenneth C. Marston, Patrick A. Coico, Peter J. Brofman, Lewis S. (Lew) Goldmann, David L. Edwards, Jeffrey A. Zitz, Sushumna Iruvanti, Subhash L. Shinde, Hai P. Longworth |
An advanced multichip module (MCM) for high-performance UNIX servers. |
IBM Journal of Research and Development |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond |
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution. |
IBM Journal of Research and Development |
1992 |
DBLP BibTeX RDF |
|
| 1 | John U. Knickerbocker, George B. Leung, William R. Miller, Steven P. Young, Scott A. Sands, Richard F. Indyk |
IBM System/390 air-cooled alumina thermal conduction module. |
IBM Journal of Research and Development |
1991 |
DBLP BibTeX RDF |
|
Displaying result #1 - #11 of 11 (100 per page; Change: )
|
|
![[Valid RSS]](Pics/valid-rss.png "Validate my RSS feed")