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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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Found 4 publication records. Showing 4 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, L. Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet |
Low temperature direct bonding: An attractive technique for heterostructures build-up.  |
Microelectronics Reliability  |
2012 |
DBLP DOI BibTeX RDF |
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| 1 | Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, F. Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka |
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. |
3DIC |
2010 |
DBLP DOI BibTeX RDF |
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| 1 | Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier |
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. |
3DIC |
2009 |
DBLP DOI BibTeX RDF |
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| 1 | Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon |
First integration of Cu TSV using die-to-wafer direct bonding and planarization. |
3DIC |
2009 |
DBLP DOI BibTeX RDF |
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