|
|
|
|
Venues (Conferences, Journals, ...)
|
|
|
GrowBag graphs for keyword ? (Num. hits/coverage)
Group by:
No Growbag Graphs found.
|
|
|
|
|
Results
Found 8 publication records. Showing 8 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Y. Celnikier, L. Dupont, E. Hervé, G. Coquery, L. Benabou |
Optimization of wire connections design for power electronics.  |
Microelectronics Reliability  |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. Celnikier, L. Benabou, L. Dupont, G. Coquery |
Investigation of the heel crack mechanism in Al connections for power electronics modules. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | L. Dupont, J. L. Blanchard, R. Lallemand, G. Coquery, Jean-Michel Morelle, G. Blondel, B. Rouleau |
Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Zoubir Khatir, L. Dupont, A. Ibrahim |
Investigations on junction temperature estimation based on junction voltage measurements. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | L. Dupont, G. Coquery, K. Kriegel, A. Melkonyan |
Accelerated active ageing test on SiC JFETs power module with silver joining technology for high temperature application. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | M. Bouarroudj, Zoubir Khatir, J. P. Ousten, F. Badel, L. Dupont, Stéphane Lefebvre |
Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | L. Dupont, Stéphane Lefebvre, M. Bouaroudj, Zoubir Khatir, Jean-Claude Faugières |
Failure modes on low voltage power MOSFETs under high temperature application. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | L. Dupont, Zoubir Khatir, Stéphane Lefebvre, S. Bontemps |
Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
Displaying result #1 - #8 of 8 (100 per page; Change: )
|
|
![[Valid RSS]](Pics/valid-rss.png "Validate my RSS feed")