| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Cheng-Ta Ko, Kuan-Neng Chen |
Low temperature bonding technology for 3D integration.  |
Microelectronics Reliability  |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga |
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Josef Lutz, Roman Baburske |
Dynamic avalanche in bipolar power devices. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Bong-Min Song, Bongtae Han, Avram Bar-Cohen, Mehmet Arik, Rajdeep Sharma, Stan Weaver |
Life prediction of LED-based recess downlight cooled by synthetic jet. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Valeria Kilchytska, Joaquín Alvarado, S. Put, Nadine Collaert, Eddy Simoen, Cor Claeys, O. Militaru, G. Berger, Denis Flandre |
High-energy neutrons effect on strained and non-strained SOI MuGFETs and planar MOSFETs. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai |
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Daquan Yu |
Development of reliable low temperature wafer level hermetic bonding using composite seal joint. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jer-Chyi Wang, Chih-Ting Lin, Pai-Chi Chou, Chao-Sung Lai |
Gadolinium-based metal oxide for nonvolatile memory applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Kyu Chung, Jae-Han Kim, Jong-Won Lee, Kyoung-Won Seo, Kyung-Wook Paik |
Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Olivér Krammer, László Milán Molnár, László Jakab, András Szabó |
Modelling the effect of uneven PWB surface on stencil bending during stencil printing process. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Liang Zhang, Cheng-wen He, Yong-huan Guo, Ji-guang Han, Yong-wei Zhang, Xu-yan Wang |
Development of SnAg-based lead free solders in electronics packaging. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | S. Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier |
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Renan Trevisoli Doria, João Antonio Martino, Eddy Simoen, Cor Claeys, Marcelo Antonio Pavanello |
An analytic method to compute the stress dependence on the dimensions and its influence in the characteristics of triple gate devices. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Hei Wong |
Advances in non-volatile memory technology. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Milan Tapajna, Nicole Killat, Uttiya Chowdhury, Jose L. Jimenez, Martin Kuball |
The role of surface barrier oxidation on AlGaN/GaN HEMTs reliability. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | R. Ardito, A. Frangi, A. Corigliano, B. De Masi, G. Cazzaniga |
The effect of nano-scale interaction forces on the premature pull-in of real-life Micro-Electro-Mechanical Systems. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Hsun-Ching Hsu, Chun-Jung Wang, Hong Ru Lin, Pin Han |
Optimized semi-sphere lens design for high power LED package. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chao-Hung Chen, Hsien-Chin Chiu, Chih-Wei Yang, Jeffrey S. Fu, Feng-Tso Chien |
Novel GaAs enhancement-mode/depletion-mode pHEMTs technology using high-k praseodymium oxide interlayer. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | M. Bagatin, Simone Gerardin, Alessandro Paccagnella, C. Andreani, G. Gorini, C. D. Frost |
Temperature dependence of neutron-induced soft errors in SRAMs. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Vitezslav Benda |
Progress in power semiconductor devices. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | P. S. Das, Abhijit Biswas |
Investigations on electrical characteristics and reliability properties of MOS capacitors using HfAlOx on n-GaAs substrates. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jyh-Rong Lin, Tuen Yi Ng, Zhaoxin Wang, Shan Mei Wan, Kin Wai Wong, Ming Lu, Enboa Wu |
Wafer-level LED-SiP based mobile flash module and characterization. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Toni T. Mattila, Jue Li, Jorma K. Kivilahti |
On the effects of temperature on the drop reliability of electronic component boards. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Takayuki Kawahara, Kenchi Ito, Riichiro Takemura, Hideo Ohno |
Spin-transfer torque RAM technology: Review and prospect. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | S. Tarasovs, J. Andersons |
Competition between the buckling-driven delamination and wrinkling in compressed thin coatings. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | H. C. Chen, K. J. Chen, C. C. Lin, C. H. Wang, C. C. Yeh, H. H. Tsai, M. H. Shih, H. C. Kuo |
Improvement of lumen efficiency in white light-emitting diodes with air-gap embedded package. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai |
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen |
Wafer-level Cu-Cu bonding technology. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Se Young Yang, Woon-Seong Kwon, Soon-Bok Lee |
Chip warpage model for reliability prediction of delamination failures. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jia-Liang Le |
A finite weakest-link model of lifetime distribution of high-k gate dielectrics under unipolar AC voltage stress. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chien-Pan Liu, Yen-Fu Liu, Chang-Hung Li, Hung-Chieh Cheng, Yi-Chun Kung, Jeng-Yu Lin |
A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Wenjian Yu, Qingqing Zhang, Zuochang Ye, Zuying Luo |
Efficient statistical capacitance extraction of nanometer interconnects considering the on-chip line edge roughness. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | J. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear |
High-lead flip chip bump cracking on the thin organic substrate in a module package. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Hung-Yu Chou, Cheng-Chien Chen, Tsung-Hsun Yang |
Maintenance of stable light emission in high power LEDs. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | William J. Roesch, Dorothy June M. Hamada, David Littleton |
Introducing a scale structure to correlate quality and reliability. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chenxi Wang, Tadatomo Suga |
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jaehyun Cho, Sungwook Jung, Kyungsoo Jang, Hyungsik Park, Jongkyu Heo, Wonbaek Lee, DaeYoung Gong, Seungman Park, Hyungwook Choi, Hanwook Jung, Byoungdeog Choi, Junsin Yi |
The effect of gate overlap lightly doped drains on low temperature poly-Si thin film transistors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | F. Fiori |
On the use of high-impedance power supplies to reduce the substrate switching noise in system-on-chips. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | C. S. Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong |
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Moon-Hwan Chang, Diganta Das, P. V. Varde, Michael G. Pecht |
Light emitting diodes reliability review. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ákos Nemcsics, Andrea Stemmann, Jeno Takács |
To the understanding of the formation of the III-V based droplet epitxial nanorings. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Minseok Ha, Samuel Graham |
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | W. C. Leong, M. Z. Abdullah, C. Y. Khor |
Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Bo-Hung Liou, Chih-Ming Chen, Ray-Hua Horng, Yi-Chen Chiang, Dong-Sing Wuu |
Improvement of thermal management of high-power GaN-based light-emitting diodes. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Rong Zhang, S. W. Ricky Lee |
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | R. K. Mamedov, M. A. Yeganeh |
Current transport and formation of energy structures in narrow Au/n-GaAs Schottky diodes. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jau-Sheng Wang, Chun-Chin Tsai, Jyun-Sian Liou, Wei-Chih Cheng, Shun-Yuan Huang, Gi-Hung Chang, Wood-Hi Cheng |
Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Matiar M. R. Howlader, Thomas E. Doyle |
Low temperature nanointegration for emerging biomedical applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | E. A. Douglas, C. Y. Chang, B. P. Gila, M. R. Holzworth, K. S. Jones, L. Liu, Jinhyung Kim, Soohwan Jang, G. D. Via, Fan Ren, S. J. Pearton |
Investigation of the effect of temperature during off-state degradation of AlGaN/GaN High Electron Mobility Transistors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | C. T. Yang, W. C. Liu, C. Y. Liu |
Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ray-Hua Horng, Re-Ching Lin, Yi-Chen Chiang, Bing-Han Chuang, Hung-Lieh Hu, Chen-Peng Hsu |
Failure modes and effects analysis for high-power GaN-based light-emitting diodes package technology. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Sachin Kumar, Nikhil M. Vichare, Eli Dolev, Michael Pecht |
A health indicator method for degradation detection of electronic products. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Feifei He, Cher Ming Tan |
Electromigration reliability of interconnections in RF low noise amplifier circuit. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | E. Atanassova, Albena Paskaleva, D. Spassov |
Doped Ta2O5 and mixed HfO2-Ta2O5 films for dynamic memories applications at the nanoscale. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | P. Pribytny, D. Donoval, A. Chvala, J. Marek, M. Molnar |
Electro-thermal analysis and optimization of edge termination of power diode supported by 2D numerical modeling and simulation. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Oi-Ying Wong, H. Wong, Wing-Shan Tam, Ted Chi-Wah Kok |
A comparative study of charge pumping circuits for flash memory applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K. S. Kim, M. Nogi |
Low-temperature low-pressure die attach with hybrid silver particle paste. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Robert Mroczynski, Romuald B. Beck |
Reliability issues of double gate dielectric stacks based on hafnium dioxide (HfO2) layers for non-volatile semiconductor memory (NVSM) applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | B. T. Donnellan, G. J. Roberts, P. A. Mawby, A. T. Bryant |
Modelling of current sharing in paralleled current limiting superjunction MOSFETs with common gate drives. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Aminul Islam, Mohd. Hasan |
A technique to mitigate impact of process, voltage and temperature variations on design metrics of SRAM Cell. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Han-Kuei Fu, Chin-Wei Lin, Tzung-Te Chen, Chiu-Ling Chen, Pei-Ting Chou, Chien-Jen Sun |
Investigation of dynamic color deviation mechanisms of high power light-emitting diode. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | W. Heo, N.-E. Lee |
Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Mingzhi Ni, Ming Li, Dali Mao |
Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Priyanka Malik, R. S. Gupta, Rishu Chaujar, Mridula Gupta |
AC analysis of nanoscale GME-TRC MOSFET for microwave and RF applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen |
BCB-to-oxide bonding technology for 3D integration. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Yu-Feng Liu, Weng-Sing Hwang, Yen-Fang Pai, Ming-Hsu Tsai |
Low temperature fabricated conductive lines on flexible substrate by inkjet printing. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | C. Y. Khor, M. Z. Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan |
Investigation of the fluid/structure interaction phenomenon in IC packaging. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | E. Marcault, M. Breil, A. Bourennane, P. Tounsi, J. M. Dorkel |
Study of mechanical stress impact on the I-V characteristics of a power VDMOS device using 2D FEM simulations. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. C. Yang, Jinn-Kong Sheu, Ming-Lun Lee, Che-Kang Hsu, Shang-Ju Tu, Shu-Yen Liu, C. C. Yang, Feng-Wen Huang |
Vertical InGaN light-emitting diodes with Ag paste as bonding layer. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Peter Ersland, Roberto Menozzi |
Editorial. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ming-Te Lin, Shang-Ping Ying, Ming-Yao Lin, Kuang-Yu Tai, Jyh-Chen Chen |
High power LED package with vertical structure. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Te-yuan Chung, Jian-Hong Jhang, Jing-Sian Chen, Yi-Chien Lo, Gwo-Herng Ho, Mount-Learn Wu, Ching-Cherng Sun |
A study of large area die bonding materials and their corresponding mechanical and thermal properties. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Hui Huang Cheng, De-Shau Huang, Ming-Tzer Lin |
Heat dissipation design and analysis of high power LED array using the finite element method. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ugo Lafont, Henk van Zeijl, Sybrand van der Zwaag |
Increasing the reliability of solid state lighting systems via self-healing approaches: A review. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Matteo Meneghini, Matteo Dal Lago, Nicola Trivellin, Giovanna Mura, Massimo Vanzi, Gaudenzio Meneghesso, Enrico Zanoni |
Chip and package-related degradation of high power white LEDs. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | I. Cortés, G. Toulon, F. Morancho, E. Hugonnard-Bruyere, B. Villard, W. J. Toren |
Analysis and optimization of lateral thin-film Silicon-on-insulator (SOI) MOSFET transistors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Bingxu Ning, Zhengxuan Zhang, Zhangli Liu, Zhiyuan Hu, Ming Chen, Dawei Bi, Shichang Zou |
Radiation-induced shallow trench isolation leakage in 180-nm flash memory technology. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Takeshi Ito, Isamu Taguchi, Masayasu Soga, Masahiko Mitsuhashi, Toshiro Shinohara, Toshinori Ogashiwa, Takashi Nishimori, Nobuyuki Akiyama |
Thermal stability of back side metallization multilayer for power device application. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Alexander Makarov, Viktor Sverdlov, Siegfried Selberherr |
Emerging memory technologies: Trends, challenges, and modeling methods. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ki Yeol Byun, Cindy Colinge |
Overview of low temperature hydrophilic Ge to Si direct bonding for heterogeneous integration. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Shengdong Hu, Jun Luo, Kaizhou Tan, Ling Zhang, Zhaoji Li, Bo Zhang, Jianlin Zhou, Ping Gan, Guolin Qin, Zhengyuan Zhang |
Realizing high breakdown voltage for a novel interface charges islands structure based on partial-SOI substrate. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Cheng-Yi Liu, S.-W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai |
Reliability of high-power LED packaging and assembly. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Lei Chen, Cheng-I. Chu, Ru-Shi Liu |
Improvement of emission efficiency and color rendering of high-power LED by controlling size of phosphor particles and utilization of different phosphors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | W. L. Lu, Y. M. Hwang |
Analysis of a vibration-induced micro-generator with a helical micro-spring and induction coil. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Yongguang Xiao, Minghua Tang, Jiancheng Li, Bo Jiang, John He |
The influence of ferroelectric-electrode interface layer on the electrical characteristics of negative-capacitance ferroelectric double-gate field-effect transistors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Charles S. Whitman |
Impact of ambient temperature set point deviation on Arrhenius estimates. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | A. S. Budiman, H.-A.-S. Shin, B.-J. Kim, S.-H. Hwang, H.-Y. Son, M.-S. Suh, Q.-H. Chung, K.-Y. Byun, N. Tamura, M. Kunz, Y.-C. Joo |
Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Janusz Smulko, Kazimierz Józwiak, Marek Olesz |
Quality testing methods of foil-based capacitors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik |
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | J. Hájek, V. Papez, B. Kojecký |
Investigation of flicker noise in silicon diodes under reverse bias. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | J. S. Karppinen, J. Li, J. Pakarinen, Toni T. Mattila, Mervi Paulasto-Kröckel |
Shock impact reliability characterization of a handheld product in accelerated tests and use environment. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jong Hwa Choi, Moo Whan Shin |
Thermal investigation of LED lighting module. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin |
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Zhihua Dong, Jinyan Wang, C. P. Wen, Shenghou Liu, Rumin Gong, Min Yu, Yilong Hao, Fujun Xu, Bo Shen, Yangyuan Wang |
High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Yih-Ming Liu, Nen-Wen Pu, Wen-Ding Chen, Kun-Hong Lin, Yuh Sung, Ming-Der Ger, Ching-Liang Chang, Te-Liand Tseng |
Low temperature fabrication of Ni-P metallic patterns on ITO substrates utilizing inkjet printing. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Pavel Poliakov, Pieter Blomme, Alessandro Vaglio Pret, Miguel Corbalan Miranda, Roel Gronheid, Diederik Verkest, Jan Van Houdt, Wim Dehaene |
Trades-off between lithography line edge roughness and error-correcting codes requirements for NAND Flash memories. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | E. J. Cheng, Y.-L. Shen |
Thermal expansion behavior of through-silicon-via structures in three-dimensional microelectronic packaging. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chi-Pu Lin, Chih-Ming Chen |
Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Vojkan Davidovic |
Reliability Physics and Engineering: Time-to-Failure Modeling, J.W. McPherson. Springer (2010). |
Microelectronics Reliability |
2012 |
DBLP BibTeX RDF |
|
| 1 | Jungwoo Joh, Jesús A. del Alamo |
Impact of gate placement on RF power degradation in GaN high electron mobility transistors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
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