| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Cheng-Ta Ko, Kuan-Neng Chen |
Low temperature bonding technology for 3D integration.  |
Microelectronics Reliability  |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga |
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Valeria Kilchytska, Joaquín Alvarado, S. Put, Nadine Collaert, Eddy Simoen, Cor Claeys, O. Militaru, G. Berger, Denis Flandre |
High-energy neutrons effect on strained and non-strained SOI MuGFETs and planar MOSFETs. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Kyu Chung, Jae-Han Kim, Jong-Won Lee, Kyoung-Won Seo, Kyung-Wook Paik |
Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high Tg ACFs in fine-pitch chip-on-glass applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Olivér Krammer, László Milán Molnár, László Jakab, András Szabó |
Modelling the effect of uneven PWB surface on stencil bending during stencil printing process. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | S. Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier |
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Milan Tapajna, Nicole Killat, Uttiya Chowdhury, Jose L. Jimenez, Martin Kuball |
The role of surface barrier oxidation on AlGaN/GaN HEMTs reliability. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | R. Ardito, A. Frangi, A. Corigliano, B. De Masi, G. Cazzaniga |
The effect of nano-scale interaction forces on the premature pull-in of real-life Micro-Electro-Mechanical Systems. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chao-Hung Chen, Hsien-Chin Chiu, Chih-Wei Yang, Jeffrey S. Fu, Feng-Tso Chien |
Novel GaAs enhancement-mode/depletion-mode pHEMTs technology using high-k praseodymium oxide interlayer. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | M. Bagatin, Simone Gerardin, Alessandro Paccagnella, C. Andreani, G. Gorini, C. D. Frost |
Temperature dependence of neutron-induced soft errors in SRAMs. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | P. S. Das, Abhijit Biswas |
Investigations on electrical characteristics and reliability properties of MOS capacitors using HfAlOx on n-GaAs substrates. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Toni T. Mattila, Jue Li, Jorma K. Kivilahti |
On the effects of temperature on the drop reliability of electronic component boards. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | S. Tarasovs, J. Andersons |
Competition between the buckling-driven delamination and wrinkling in compressed thin coatings. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai |
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ya-Sheng Tang, Yao-Jen Chang, Kuan-Neng Chen |
Wafer-level Cu-Cu bonding technology. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jia-Liang Le |
A finite weakest-link model of lifetime distribution of high-k gate dielectrics under unipolar AC voltage stress. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | J. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear |
High-lead flip chip bump cracking on the thin organic substrate in a module package. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | William J. Roesch, Dorothy June M. Hamada, David Littleton |
Introducing a scale structure to correlate quality and reliability. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chenxi Wang, Tadatomo Suga |
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jaehyun Cho, Sungwook Jung, Kyungsoo Jang, Hyungsik Park, Jongkyu Heo, Wonbaek Lee, DaeYoung Gong, Seungman Park, Hyungwook Choi, Hanwook Jung, Byoungdeog Choi, Junsin Yi |
The effect of gate overlap lightly doped drains on low temperature poly-Si thin film transistors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | F. Fiori |
On the use of high-impedance power supplies to reduce the substrate switching noise in system-on-chips. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | C. S. Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong |
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ákos Nemcsics, Andrea Stemmann, Jeno Takács |
To the understanding of the formation of the III-V based droplet epitxial nanorings. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | R. K. Mamedov, M. A. Yeganeh |
Current transport and formation of energy structures in narrow Au/n-GaAs Schottky diodes. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Matiar M. R. Howlader, Thomas E. Doyle |
Low temperature nanointegration for emerging biomedical applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | E. A. Douglas, C. Y. Chang, B. P. Gila, M. R. Holzworth, K. S. Jones, L. Liu, Jinhyung Kim, Soohwan Jang, G. D. Via, Fan Ren, S. J. Pearton |
Investigation of the effect of temperature during off-state degradation of AlGaN/GaN High Electron Mobility Transistors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Sachin Kumar, Nikhil M. Vichare, Eli Dolev, Michael Pecht |
A health indicator method for degradation detection of electronic products. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Feifei He, Cher Ming Tan |
Electromigration reliability of interconnections in RF low noise amplifier circuit. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | K. Suganuma, S. Sakamoto, N. Kagami, D. Wakuda, K. S. Kim, M. Nogi |
Low-temperature low-pressure die attach with hybrid silver particle paste. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Robert Mroczynski, Romuald B. Beck |
Reliability issues of double gate dielectric stacks based on hafnium dioxide (HfO2) layers for non-volatile semiconductor memory (NVSM) applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Aminul Islam, Mohd. Hasan |
A technique to mitigate impact of process, voltage and temperature variations on design metrics of SRAM Cell. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | W. Heo, N.-E. Lee |
Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Mingzhi Ni, Ming Li, Dali Mao |
Adhesion improvement of Epoxy Molding Compound - Pd Preplated leadframe interface using shaped nickel layers. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Priyanka Malik, R. S. Gupta, Rishu Chaujar, Mridula Gupta |
AC analysis of nanoscale GME-TRC MOSFET for microwave and RF applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | S. L. Lin, W. C. Huang, C. T. Ko, Kuan-Neng Chen |
BCB-to-oxide bonding technology for 3D integration. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Yu-Feng Liu, Weng-Sing Hwang, Yen-Fang Pai, Ming-Hsu Tsai |
Low temperature fabricated conductive lines on flexible substrate by inkjet printing. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | C. Y. Khor, M. Z. Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan |
Investigation of the fluid/structure interaction phenomenon in IC packaging. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Peter Ersland, Roberto Menozzi |
Editorial. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ugo Lafont, Henk van Zeijl, Sybrand van der Zwaag |
Increasing the reliability of solid state lighting systems via self-healing approaches: A review. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Bingxu Ning, Zhengxuan Zhang, Zhangli Liu, Zhiyuan Hu, Ming Chen, Dawei Bi, Shichang Zou |
Radiation-induced shallow trench isolation leakage in 180-nm flash memory technology. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Takeshi Ito, Isamu Taguchi, Masayasu Soga, Masahiko Mitsuhashi, Toshiro Shinohara, Toshinori Ogashiwa, Takashi Nishimori, Nobuyuki Akiyama |
Thermal stability of back side metallization multilayer for power device application. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ki Yeol Byun, Cindy Colinge |
Overview of low temperature hydrophilic Ge to Si direct bonding for heterogeneous integration. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | W. L. Lu, Y. M. Hwang |
Analysis of a vibration-induced micro-generator with a helical micro-spring and induction coil. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Charles S. Whitman |
Impact of ambient temperature set point deviation on Arrhenius estimates. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik |
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | J. S. Karppinen, J. Li, J. Pakarinen, Toni T. Mattila, Mervi Paulasto-Kröckel |
Shock impact reliability characterization of a handheld product in accelerated tests and use environment. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Dhafer Abdulameer Shnawah, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin |
A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Zhihua Dong, Jinyan Wang, C. P. Wen, Shenghou Liu, Rumin Gong, Min Yu, Yilong Hao, Fujun Xu, Bo Shen, Yangyuan Wang |
High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructure. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Yih-Ming Liu, Nen-Wen Pu, Wen-Ding Chen, Kun-Hong Lin, Yuh Sung, Ming-Der Ger, Ching-Liang Chang, Te-Liand Tseng |
Low temperature fabrication of Ni-P metallic patterns on ITO substrates utilizing inkjet printing. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Chi-Pu Lin, Chih-Ming Chen |
Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Vojkan Davidovic |
Reliability Physics and Engineering: Time-to-Failure Modeling, J.W. McPherson. Springer (2010). |
Microelectronics Reliability |
2012 |
DBLP BibTeX RDF |
|
| 1 | Jungwoo Joh, Jesús A. del Alamo |
Impact of gate placement on RF power degradation in GaN high electron mobility transistors. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Hermann Oppermann, Lothar Dietrich |
Nanoporous gold bumps for low temperature bonding. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | André Touboul, L. Foro, Frederic Wrobel, Frédéric Saigné |
On the reliability assessment of trench fieldstop IGBT under atmospheric neutron spectrum. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | E. Herth, H. Desré, E. Algré, C. Legrand, T. Lasri |
Investigation of optical and chemical bond properties of hydrogenated amorphous silicon nitride for optoelectronics applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, L. Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet |
Low temperature direct bonding: An attractive technique for heterostructures build-up. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Feng-Renn Juang, Yean-Kuen Fang, Hung-Yu Chiu |
Dependence of the Au/SnOx/n-LTPS/glass thin film MOS Schottky diode CO gas sensing performances on operating temperature. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Pawel Salek, Lidia Lukasiak, Andrzej Jakubowski |
New threshold voltage definition for undoped symmetrical DG MOSFET. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Michael Ferrara, Michael Stephens, Leslie Marchut, Chris Yang, Ventony Fryar, Preston Scott |
Analysis of in situ monitored thermal cycling benefits for wireless packaging early reliability evaluation. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Tibor Grasser |
Stochastic charge trapping in oxides: From random telegraph noise to bias temperature instabilities. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee |
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | O. Thomas, C. Hunt, M. Wickham |
Finite difference modelling of moisture diffusion in printed circuit boards with ground planes. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Yong Jiang, Li-Lung Lai, Jian-Jun Zhou |
Single-bit failure analysis at a nanometer resolution by conductive atomic force microscopy. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. J. Chen, C. C. Chang, H. Y. Lin, S. C. Hsu, C. Y. Liu |
Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Oscar Ruano, Juan Antonio Maestro, Pedro Reviriego |
A fast and efficient technique to apply Selective TMR through optimization. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Lucas Brusamarello, Gilson I. Wirth, Philippe Roussel, Miguel Miranda |
Fast and accurate statistical characterization of standard cell libraries. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | E. A. Douglas, C. Y. Chang, D. J. Cheney, B. P. Gila, C. F. Lo, Liu Lu, M. R. Holzworth, P. Whiting, K. S. Jones, G. D. Via, Jinhyung Kim, Soohwan Jang, Fan Ren, S. J. Pearton |
AlGaN/GaN High Electron Mobility Transistor degradation under on- and off-state stress. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | O. Hölck, E. Dermitzaki, Bernhard Wunderle, Jörg Bauer 0002, Bernd Michel |
Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung |
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | I. Qin, A. Shah, C. Huynh, M. Meyer, M. Mayer, Y. Zhou |
Role of process parameters on bondability and pad damage indicators in copper ball bonding. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Sakir Aydogan, Ümit Incekara, Abdulmecit Türüt |
The effects of 12 MeV electron irradiation on the electrical characteristics of the Au/Aniline blue/p-Si/Al device. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Karol Malecha, Thomas Maeder, Caroline Jacq, Peter Ryser |
Structuration of the low temperature co-fired ceramics (LTCC) using novel sacrificial graphite paste with PVA-propylene glycol-glycerol-water vehicle. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Wenyan Gen, Xi Chen, Anmin Hu, Ming Li |
Effect of Ag on oxidation of Cu-base leadframe. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | J. K. Mee, R. A. B. Devine, L. Trombetta, R. J. Kaplar, P. Gouker |
Anomalous drain voltage dependence in bias temperature instability measurements on high-κ field effect transistors. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | A. Shah, A. Rezvani, M. Mayer, Y. Zhou, J. Persic, J. T. Moon |
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | M. Felczak, Boguslaw Wiecek |
Application of genetic algorithms for electronic devices placement in structures with heat conduction through the substrate. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Fu-Zhen Xuan, Shan-Shan Shao, Qing-Qi Chen |
Synthesis creep behavior of Sn63Pb37 under the applied stress and electric current. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | I.-Ting Huang, Fei-Yi Hung, Truan-Sheng Lui, Li-Hui Chen, Hao-Wen Hsueh |
A study on the tensile fracture mechanism of 15 μm copper wire after EFO process. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Hsien-Chin Chiu, Chao-Wei Lin, Che-Kai Lin, Hsuan-Ling Kao, Jeffrey S. Fu |
Thermal stability investigations of AlGaN/GaN HEMTs with various high work function gate metal designs. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Zhangli Liu, Zhiyuan Hu, Zhengxuan Zhang, Hua Shao, Ming Chen, Dawei Bi, Bingxu Ning, Shichang Zou |
Comparison of TID response in core, input/output and high voltage transistors for flash memory. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | D. Zade, Soshi Sato, Kuniyuki Kakushima, A. Srivastava, Parhat Ahmet, Kazuo Tsutsui, A. Nishiyama, Nobuyuki Sugii, Kenji Natori, Takeo Hattori, Chandan Kumar Sarkar, Hiroshi Iwai |
Effects of La2O3 incorporation in HfO2 gated nMOSFETs on low-frequency noise. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. Weber |
Mechanism of breakdown voltage wavering in power MOSFET induced by silicon crystalline defect. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | J. P. Ousten, Zoubir Khatir |
Investigations of thermal interfaces aging under thermal cycling conditions for power electronics applications. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Anirban Sengupta, Reza Sedaghat, Zhipeng Zeng |
Rapid design space exploration by hybrid fuzzy search approach for optimal architecture determination of multi objective computing systems. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Christopher Urban, James E. Moon, Ponnathpur R. Mukund |
Scaling the bulk-driven MOSFET into deca-nanometer bulk CMOS processes. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Fong-Jung Yu, Yung-Yu Yang, Ming-Jaan Wang, Zhang Wu |
Using EWMA control schemes for monitoring wafer quality in negative binomial process. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Muhammad Bashir, Linda Milor, Dae Hyun Kim, Sung Kyu Lim |
Impact of irregular geometries on low-k dielectric breakdown. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Adam Witold Stadler |
Noise properties of thick-film resistors in extended temperature range. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Ping Cheng, Yuming Zhang, Yimen Zhang |
Characteristics of the intrinsic defects in unintentionally doped 4H-SiC after thermal annealing. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Katarzyna Tadaszak, Karol Nitsch, Tomasz Piasecki, Witold M. Posadowski |
Electrical characterization of aluminium oxide-aluminium thin film composites by impedance spectroscopy. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | F. Bossuyt, J. Guenther, Thomas Löher, Manuel Seckel, T. Sterken, J. de Vries |
Cyclic endurance reliability of stretchable electronic substrates. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Stanislav Tyaginov, Ivan Starkov, Hubert Enichlmair, C. Jungemann, J. M. Park, E. Seebacher, R. L. de Orio, Hajdin Ceric, Tibor Grasser |
An analytical approach for physical modeling of hot-carrier induced degradation. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | R. Arinero, En-xia Zhang, Nadia Rezzak, Ronald D. Schrimpf, Daniel M. Fleetwood, B. K. Choï, A. B. Hmelo, J. Mekki, André Touboul, Frédéric Saigné |
High fluence 1.8 MeV proton irradiation effects on n-type MOS capacitors. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. Celnikier, L. Dupont, E. Hervé, G. Coquery, L. Benabou |
Optimization of wire connections design for power electronics. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Guido Notermans, Dejan M. Maksimovic, Gerd Vermont, Michiel van Maasakkers, Fredrik Pusa, Theo Smedes |
On-chip system level protection of FM antenna pin with improved linearity. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | B. Güzeldir, M. Saglam, A. Ates |
Laterally inhomogeneous barrier analysis of identically prepared Cd/CdS/n-Si/Au-Sb structures by SILAR method. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | F. Infante, Philippe Perdu, H. B. Kor, C. L. Gan, Dean Lewis |
Magnetic field spatial Fourier analysis: A new opportunity for high resolution current localization. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Pyungho Shin, Sukjong Lee, Jaeyong Sung, Jong Hyeong Kim |
Operability diagram of drop formation and its response to temperature variation in a piezoelectric inkjet nozzle. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Peter Sandborn, V. Prabhakar, O. Ahmad |
Forecasting electronic part procurement lifetimes to enable the management of DMSMS obsolescence. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Yin Lee Goh, Agileswari K. Ramasamy, Farrukh Hafiz Nagi, Aidil Azwin Zainul Abidin |
DSP based overcurrent relay using fuzzy bang-bang controller. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
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