| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Yao Yao, Leon M. Keer |
Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact.  |
Microelectronics Reliability  |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier |
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | C. Y. Khor, M. Z. Abdullah |
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Rui Huang, Paul S. Ho |
Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Vladimir Kosel, Stefano de Filippis, L. Chen, Stefan Decker, Andrea Irace |
FEM simulation approach to investigate electro-thermal behavior of power transistors in 3-D. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | P. Jesudoss, Alan Mathewson, W. M. D. Wright, F. Stam |
Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Kong-Pang Pun, Lei Sun, Bing Li |
Unit capacitor array based SAR ADC. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Nicolas Monnereau, Fabrice Caignet, David Trémouilles, Nicolas Nolhier, M. Bafleur |
Building-up of system level ESD modeling: Impact of a decoupling capacitance on ESD propagation. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Xi Liu, Qiao Chen, Venkatesh Sundaram, Rao R. Tummala, Suresh K. Sitaraman |
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Hakim Tahi, Boualem Djezzar, Abdelmadjid Benabdelmoumene |
A new procedure for eliminating the geometric component from charge pumping: Application for NBTI and radiation issues. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Ernest E. S. Ong, M. Z. Abdullah, W. K. Loh, C. K. Ooi, R. Chan |
FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Bong-Min Song, Bongtae Han, Joon-Hyun Lee |
Optimum design domain of LED-based solid state lighting considering cost, energy consumption and reliability. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Toru Ikeda, Toshifumi Kanno, Nobuyuki Shishido, Noriyuki Miyazaki, Hiroyuki Tanaka, Takuya Hatao |
Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Anirudh Udupa, Ganesh Subbarayan, Cheng-Kok Koh |
Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Qinghua Wang, Satoshi Kishimoto, Huimin Xie, Zhanwei Liu, Xinhao Lou |
In situ high temperature creep deformation of micro-structure with metal film wire on flexible membrane using geometric phase analysis. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Hironori Tohmyoh, Shoho Ishikawa, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano |
Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai |
Reliability of micro-interconnects in 3D IC packages. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Vesselin K. Vassilev |
Advances in ESD protection for ICs. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Masaki Omiya, Kozo Koiwa, Nobuyuki Shishido, Shoji Kamiya, Chuantong Chen, Hisashi Sato, Masahiro Nishida, Takashi Suzuki, Tomoji Nakamura, Toshiaki Suzuki, Takeshi Nokuo |
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Rajni Gautam, Manoj Saxena, R. S. Gupta, Mridula Gupta |
Numerical analysis of localised charges impact on static and dynamic performance of nanoscale cylindrical surrounding gate MOSFET based CMOS inverter. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | D. Nirmal, P. Vijayakumar, Divya Mary Thomas, Binola K. Jebalin, N. Mohankumar |
Subthreshold performance of gate engineered FinFET devices and circuit with high-k dielectrics. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Cheng-Ta Ko, Kuan-Neng Chen |
Reliability of key technologies in 3D integration. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Liqiang Han, Suying Yao, Jiangtao Xu, Chao Xu |
Characteristics of random telegraph signal noise in time delay integration CMOS image sensor. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Han-Kuei Fu, Chien-Ping Wang, Hsin-Chien Chiang, Tzung-Te Chen, Chiu-Ling Chen, Pei-Ting Chou |
Evaluation of temperature distribution of LED module. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | K. N. Tu, Hsiang-Yao Hsiao, Chih Chen |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Xingming Long, Rui-Jin Liao, Jing Zhou, Zhi Zeng |
Thermal uniformity of packaging multiple light-emitting diodes embedded in aluminum-core printed circuit boards. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Orazio Aiello, Franco Fiori |
A new MagFET-based integrated current sensor highly immune to EMI. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Y.-L. Shen, R. W. Johnson |
Misalignment induced shear deformation in 3D chip stacking: A parametric numerical assessment. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Jianguang Chen, Liang Feng, Yuhua Cheng |
Research and design of a power management chip for wireless powering capsule endoscopy. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Timothy J. Maloney |
HBM tester waveforms, equivalent circuits, and socket capacitance. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Laura Ciammaruchi, Stefano Penna, Andrea Reale, Thomas M. Brown, Aldo Di Carlo |
Acceleration factor for ageing measurement of dye solar cells. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Seung Eun Lee |
Adaptive error correction in Orthogonal Latin Square Codes for low-power, resilient on-chip interconnection network. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Xin Li, Gang Chen, Xu Chen, Guo-Quan Lu, Lei Wang, Yun-Hui Mei |
High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Nihaar N. Mahatme, Indranil Chatterjee, Akash Patki, Daniel B. Limbrick, Bharat L. Bhuva, Ronald D. Schrimpf, William H. Robinson |
An efficient technique to select logic nodes for single event transient pulse-width reduction. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | T. Bentrcia, Fayçal Djeffal, M. Chahdi |
An analytical two dimensional subthreshold behavior model to study the nanoscale GCGS DG Si MOSFET including interfacial trap effects. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Naushad Alam, Bulusu Anand, Sudeb Dasgupta |
The impact of process-induced mechanical stress on CMOS buffer design using multi-fingered devices. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | B. Li, X. P. Zhang, Y. Yang, L. M. Yin, Michael G. Pecht |
Size and constraint effects on interfacial fracture behavior of microscale solder interconnects. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Xinjun Sheng, Lei Jia, Zhenhua Xiong, Zhiping Wang, Han Ding |
ACF-COG interconnection conductivity inspection system using conductive area. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Chao-Wei Tang, Kuan-Ming Li, Mike Yang, Hsueh-Chuan Liao, Hong-Tsu Young |
Improving the dielectric breakdown field of silicon light-emitting-diode sub-mount by a hybrid nanosecond laser drilling strategy. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Gang Chen, Ze-Sheng Zhang, Yun-Hui Mei, Xin Li, Guo-Quan Lu, Xu Chen |
Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Luowei Zhou, Shengqi Zhou, Mingwei Xu |
Investigation of gate voltage oscillations in an IGBT module after partial bond wires lift-off. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Kil-Ho Kim, Yong-Jin Seo |
Electrostatic discharge (ESD) protection of N-type silicon controlled rectifier with P-type MOSFET pass structure for high voltage operating I/O application. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Jong-Ning Aoh, Cheng-Li Chuang, Min-Yi Kang |
Reliability of TCT and HH/HT test performed in chips and flex substrates assembled by thermosonic flip-chip bonding process. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Zhouying Zhao, Lynn Rice, Harry Efstathiadis, Pradeep Haldar |
Annealing and thickness related performance and degradation of polymer solar cells. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Adam Golda, Andrzej Kos |
Optimum control of microprocessor throughput under thermal and energy saving constraints. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Aiwu Ruan, Shi Kang, Yu Wang, Xiao Han, Zujian Zhu, Yongbo Liao, Peng Li |
A Built-In Self-Test (BIST) system with non-intrusive TPG and ORA for FPGA test and diagnosis. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Chien-Yi Huang |
Reliability assessment of RFID reader through prognostics and health management. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Hsien-Chin Chiu, Chao-Wei Lin, Fan-Hsiu Huang, Hsuan-Ling Kao, Feng-Tso Chien, Hao-Wei Chuang, Kuo-Jen Chang, Yau-Tang Gau |
Low frequency noise in field-plate multigate AlGaN/GaN single-pole-single-throw RF switches on silicon substrate. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Jacques Tardy, Mohsen Erouel |
Stability of pentacene transistors under concomitant influence of water vapor and bias stress. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | D. Misra, Jyothi Kasinath, Arun N. Chandorkar |
Voltage and current stress induced variations in TiN/HfSixOy/TiN MIM capacitors. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Mika Maaspuro, Aulis Tuominen |
Thermal analysis of LED spot lighting device operating in external natural or forced heat convection. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Yang Yang, Yongzhi Li, Hao Lu, Chun Yu, Junmei Chen |
Interdiffusion at the interface between Sn-based solders and Cu substrate. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Wen-Hwa Chen, Ching-Feng Yu, Hsien-Chie Cheng, Yu-min Tsai, Su-Tsai Lu |
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Mototsugu Okushima, Junji Tsuruta |
Secondary ESD clamp circuit for CDM protection of over 6 Gbit/s SerDes application in 40 nm CMOS. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Wen-Kuan Yeh, Po-Ying Chen, Kwang-Jow Gan, Jer-Chyi Wang, Chao-Sung Lai |
The impact of interface/border defect on performance and reliability of high-k/metal-gate CMOSFET. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. W. Chang, H. Y. Peng, R. W. Yang, Chih Chen, T. C. Chang, Chau-Jie Zhan, Jin-Ye Juang, Annie T. Huang |
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Ganesh C. Patil, S. Qureshi |
Engineering buried oxide in dopant-segregated Schottky barrier SOI MOSFET for nanoscale CMOS circuits. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Anindya Jana, Nameirakpam Basanta Singh, J. K. Sing, Subir Kumar Sarkar |
Design and simulation of hybrid CMOS-SET circuits. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Guoxuan Qin, Guogong Wang, Ningyue Jiang, Jianguo Ma, Zhenqiang Ma |
On the configuration- and frequency-dependent linearity characteristics of SiGe HBTs under different impedance matching conditions. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Jun-Hyuk Seo, Ji-Young Kim, Young-Bae Kim, Dong-Wook Kim, Haeri Kim, Hyun Cho, Duck-Kyun Choi |
Multi-level storage in a nano-floating gate MOS capacitor using a stepped control oxide. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Jawar Singh, N. Vijaykrishnan |
A highly reliable NBTI Resilient 6T SRAM cell. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | T. Frank, S. Moreau, C. Chappaz, Patrick Leduc, L. Arnaud, Aurélie Thuaire, E. Chery, F. Lorut, L. Anghel, G. Poupon |
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Tong Hong Wang, Ching-I. Tsai, Chang-Chi Lee, Yi-Shao Lai |
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Seong-Hun Na, Seung-Kyu Lim, Jin-Soo Kim, Hwa-Sun Park, Heung-Jae Oh, Jin-Won Choi, Su-Jeong Suh |
Experimental study of bump void formation according to process conditions. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Huang-Kuang Kung, Hung-Shyong Chen, Ming-Cheng Lu |
The wire sag problem in wire bonding technology for semiconductor packaging. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Bingxu Ning, Dawei Bi, Huixiang Huang, Zhengxuan Zhang, Zhiyuan Hu, Ming Chen, Shichang Zou |
Bias dependence of TID radiation responses of 0.13 μm partially depleted SOI NMOSFETs. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Yap Boon Kar, Tan Cai Hui, Ramasamy Agileswari, Calvin Lo |
Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | V. S. Balderrama, Magali Estrada, A. Viterisi, P. Formentin, Josep Pallarès, J. Ferré-Borrull, E. Palomares, Lluís F. Marsal |
Correlation between P3HT inter-chain structure and Jsc of P3HT: PC[70]BM blends for solar cells. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Vemal Raja Manikam, Khairunisak Abdul Razak, Kuan Yew Cheong |
Reliability of sintered Ag80-Al20 die attach nanopaste for high temperature applications on SiC power devices. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | T. Smedes, M. Polewski, A. van IJzerloo, Jean Luc Lefebvre, M. Dekker |
Pitfalls for CDM calibration procedures. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Adelmo Ortiz-Conde, Francisco J. García-Sánchez, Juan Muci, Alberto Terán Barrios, Juin J. Liou, Ching-Sung Ho |
Revisiting MOSFET threshold voltage extraction methods. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Chih-Ting Yeh, Ming-Dou Ker |
PMOS-based power-rail ESD clamp circuit with adjustable holding voltage controlled by ESD detection circuit. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | S. L. Jang, J. S. Yuan, S. D. Yen, E. Kritchanchai, G. W. Huang |
Experimental evaluation of hot electron reliability on differential Clapp-VCO. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Syed Askari, Mehrdad Nourani |
An on-chip sensor to measure and compensate static NBTI-induced degradation in analog circuits. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun |
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Anupama Tiwari, Dilip Roy |
Estimation of reliability of mobile handsets using Cox-proportional hazard model. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Venkatesh Arasanipalai Raghavan, Brian Roggeman, Michael Meilunas, Peter Borgesen |
Effects of 'Latent Damage' on pad cratering: Reduction in life and a potential change in failure mode. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Mahdiar Hosein Ghadiry, Mahdieh Nadi Senjani, M. Bahadorian, Asrulnizam A. B. D. Manaf, H. Karimi, Hatef Sadeghi |
An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Yue Xu, Chun-bo Wu, Xiao-li Ji, Feng Yan, Yi Shi |
An improved multilevel cell programming technique for 4-bits/cell localized trapping SONOS memory devices. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Zlatica Marinkovic, Nenad Ivkovic, Olivera Pronic-Rancic, Vera Markovic, Alina Caddemi |
Analysis and validation of neural network approach for extraction of small-signal model parameters of microwave transistors. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Jie Chen, Zhengwei Du |
Device simulation studies on latch-up effects in CMOS inverters induced by microwave pulse. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Artur Wymyslowski, Lukasz Dowhan |
Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Saurabh Kothawade, Koushik Chakraborty |
Analysis and mitigation of BTI aging in register file: An application driven approach. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. J. Chen, C. K. Chung, C. R. Yang, C. R. Kao |
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Sung-Jae Chang, Maryline Bawedin, Wade Xiong, Jong-Hyun Lee, Jung-Hee Lee, Sorin Cristoloveanu |
Remote carrier trapping in FinFETs with ONO buried layer: Temperature effects. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Abhijit Biswas, Swagata Bhattacherjee |
Accurate modeling of the influence of back gate bias and interface roughness on the threshold voltage of nanoscale DG MOSFETs. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Narjes Moghadam, Mohammad Kazem Moravvej-Farshi, Mohammad Reza Aziziyan |
Design and simulation of MOSCNT with band engineered source and drain regions. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | N. Lukyanchikova, N. Garbar, V. Kudina, A. Smolanka, Eddy Simoen, Cor Claeys |
Drain currents and their excess noise in triple gate bulk p-channel FinFETs of different geometry. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Yuanzhong (Paul) Zhou, David Ellis, Jean-Jacques Hajjar, Andrew Olney, Juin J. Liou |
vfTLP-VTH: A new method for quantifying the effectiveness of ESD protection for the CDM classification test. |
Microelectronics Reliability |
2013 |
DBLP DOI BibTeX RDF |
|
| 1 | Cheng-Ta Ko, Kuan-Neng Chen |
Low temperature bonding technology for 3D integration. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Song Lan, Cher Ming Tan, Kevin Wu |
Reliability study of LED driver - A case study of black box testing. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga |
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Josef Lutz, Roman Baburske |
Dynamic avalanche in bipolar power devices. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | R. L. Torrisi, V. Maiorana, R. Nicolosi, G. Presti |
Catastrophic flip-chip failures at thermal cycles caused by micro-cracks in passivation layer, present only in the spacing between minimum width stripes of last metal level. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim, Jong-Soo Kim, Kyung-Wook Paik |
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs). |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | A. Zanandrea, Eldad Bahat-Treidel, F. Rampazzo, A. Stocco, Matteo Meneghini, Enrico Zanoni, O. Hilt, Ponky Ivo, J. Wuerfl, Gaudenzio Meneghesso |
Single- and double-heterostructure GaN-HEMTs devices for power switching applications. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Dominik Lorenz, Martin Barke, Ulf Schlichtmann |
Efficiently analyzing the impact of aging effects on large integrated circuits. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Raffaele De Rose, A. Malomo, Paolo Magnone, Felice Crupi, G. Cellere, M. Martire, D. Tonini, Enrico Sangiorgi |
A methodology to account for the finger interruptions in solar cell performance. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Bong-Min Song, Bongtae Han, Avram Bar-Cohen, Mehmet Arik, Rajdeep Sharma, Stan Weaver |
Life prediction of LED-based recess downlight cooled by synthetic jet. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Valeria Kilchytska, Joaquín Alvarado, S. Put, Nadine Collaert, Eddy Simoen, Cor Claeys, O. Militaru, G. Berger, Denis Flandre |
High-energy neutrons effect on strained and non-strained SOI MuGFETs and planar MOSFETs. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
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