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Venues (Conferences, Journals, ...)
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GrowBag graphs for keyword ? (Num. hits/coverage)
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The graphs summarize 9 occurrences of 7 keywords
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Results
Found 15 publication records. Showing 15 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Varun J. Prabhakar, Peter Sandborn |
A part total cost of ownership model for long life cycle electronic systems.  |
Int. J. Computer Integrated Manufacturing  |
2012 |
DBLP DOI BibTeX RDF |
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| 1 | Peter Sandborn, Varun J. Prabhakar, O. Ahmad |
Forecasting electronic part procurement lifetimes to enable the management of DMSMS obsolescence. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
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| 1 | Kiri Feldman, Taoufik Jazouli, Peter Sandborn |
A Methodology for Determining the Return on Investment Associated With Prognostics and Health Management. |
IEEE Transactions on Reliability |
2009 |
DBLP DOI BibTeX RDF |
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| 1 | Peter Sandborn, Michael G. Pecht |
Introduction to special section on electronic systems prognostics and health management. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
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| 1 | E. Scanff, K. L. Feldman, S. Ghelam, Peter Sandborn, M. Glade, B. Foucher |
Life cycle cost impact of using prognostic health management (PHM) for helicopter avionics. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
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| 1 | Zhen Shi, Peter Sandborn |
Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic System Assembly. |
J. Electronic Testing |
2006 |
DBLP DOI BibTeX RDF |
yielded cost, electronic assembly, optimization, test strategies, test economics |
| 1 | Zhen Shi, Peter Sandborn |
Optimization of Test/Diagnosis/Rework Location(s) and Characteristics in Electronic Systems Assembly Using Real-Coded Genetic Algorithms. |
ITC |
2003 |
DBLP DOI BibTeX RDF |
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| 1 | Daniel Ragan, Peter Sandborn, Paul Stoaks |
A detailed cost model for concurrent use with hardware/software co-design. |
DAC |
2002 |
DBLP DOI BibTeX RDF |
cost-performance trade-off, cost modeling |
| 1 | Bharatwaj Ramakrishnan, Peter Sandborn, Michael G. Pecht |
Process capability indices and product reliability. |
Microelectronics Reliability |
2001 |
DBLP DOI BibTeX RDF |
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| 1 | Thiagarajan Trichy, Peter Sandborn, Ravi Raghavan, Shubhada Sahasrabudhe |
A new test/diagnosis/rework model for use in technical cost modeling of electronic systems assembly. |
ITC |
2001 |
DBLP DOI BibTeX RDF |
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| 1 | Peter Sandborn, Mike Vertal |
Analyzing Packaging Trade-Offs During System Design. |
IEEE Design & Test of Computers |
1998 |
DBLP DOI BibTeX RDF |
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| 1 | Cynthia F. Murphy, Magdy S. Abadir, Peter Sandborn |
Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die. |
J. Electronic Testing |
1997 |
DBLP DOI BibTeX RDF |
known good die, bare die test, multichip modules |
| 1 | Magdy S. Abadir, Ashish Parikh, Linda Bal, Peter Sandborn, Cynthia F. Murphy |
High Level Test Economics Advisor (Hi-TEA). |
J. Electronic Testing |
1994 |
DBLP DOI BibTeX RDF |
MCM testing strategies, multichip module, test economics |
| 1 | Peter Sandborn, Rajarshi Ghosh, Ken Drake, Magdy S. Abadir, Linda Bal, Ashish Parikh |
Multichip systems trade-off analysis tool. |
J. Electronic Testing |
1994 |
DBLP DOI BibTeX RDF |
flip chip bonding, multichip module (MCM), packaging and interconnect, Conceptual design, trade-off analysis |
| 1 | Magdy S. Abadir, Ashish R. Parikh, Linda Bal, Peter Sandborn, Ken Drake |
Analyzing Multichip Module Testing Strategies. |
IEEE Design & Test of Computers |
1994 |
DBLP DOI BibTeX RDF |
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Displaying result #1 - #15 of 15 (100 per page; Change: )
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