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Publications of "Toni T. Mattila" ( http://dblp.L3S.de/Authors/Toni_T._Mattila )

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Publication years (Num. hits)
2007 (1) 2010 (3) 2011 (1) 2012 (2)
Publication types (Num. hits)
article(6) inproceedings(1)
Venues (Conferences, Journals, ...)
Microelectronics Reliability(6) Simulation Modelling Practice ...(1)
Authors
Toni T. Mattila(7) J. Li(3) J. S. Karppinen(3) Jorma K. Kivilahti(3) Jue Li(3) Mervi Paulasto-Kröckel(3) H. Xu(1) J. Pakarinen(1) Jarmo Teeri(1) Jussi Hokka(1) M. Paulasto(1) M. Sippola(1) Tomi Laurila(1) V. Vuorinen(1)
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Results
Found 7 publication records. Showing 7 according to the selection in the facets
Hits ?▲ Authors Title Venue Year Link Author keywords
1Toni T. Mattila, Jue Li, Jorma K. Kivilahti On the effects of temperature on the drop reliability of electronic component boards. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2012 DBLP  DOI  BibTeX  RDF
1J. S. Karppinen, J. Li, J. Pakarinen, Toni T. Mattila, Mervi Paulasto-Kröckel Shock impact reliability characterization of a handheld product in accelerated tests and use environment. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2012 DBLP  DOI  BibTeX  RDF
1Toni T. Mattila, Mervi Paulasto-Kröckel Toward comprehensive reliability assessment of electronics by a combined loading approach. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2011 DBLP  DOI  BibTeX  RDF
1Jussi Hokka, Toni T. Mattila, Jue Li, Jarmo Teeri, Jorma K. Kivilahti A novel impact test system for more efficient reliability testing. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2010 DBLP  DOI  BibTeX  RDF
1J. Li, Toni T. Mattila, H. Xu, M. Paulasto FEM simulations for reliability assessment of component boards drop tested at various temperatures. Search on Bibsonomy Simulation Modelling Practice and Theory The full citation details ... 2010 DBLP  DOI  BibTeX  RDF
1J. S. Karppinen, J. Li, Toni T. Mattila, Mervi Paulasto-Kröckel Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2010 DBLP  DOI  BibTeX  RDF
1Tomi Laurila, Toni T. Mattila, V. Vuorinen, J. S. Karppinen, Jue Li, M. Sippola, Jorma K. Kivilahti Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. Search on Bibsonomy Microelectronics Reliability The full citation details ... 2007 DBLP  DOI  BibTeX  RDF
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