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Found 34 publication records. Showing 34 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung |
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates.  |
Microelectronics Reliability  |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung |
Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. C. Chan, W. A. Johnson, S. K. Karuza, A. M. Young, J. C. Camparo |
Self-Monitoring and Self-Assessing Atomic Clocks. |
IEEE T. Instrumentation and Measurement |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Mansur Ahmed, Tama Fouzder, Ahmed Sharif, Asit Kumar Gain, Y. C. Chan |
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung |
Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | J. Shen, Y. C. Chan |
Research advances in nano-composite solders. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung |
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | R. Smit, A. L. Brown, Y. C. Chan |
Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow? |
Environmental Modelling and Software |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Sachin Kumar, Myra Torres, Y. C. Chan, Michael Pecht |
A hybrid prognostics methodology for electronic products. |
IJCNN |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Rashed Adnan Islam, Y. C. Chan, W. Jillek, Samia Islam |
Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. |
Microelectronics Journal |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu 0003 |
Study of anisotropic conductive adhesive joint behavior under 3-point bending. |
Microelectronics Reliability |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan |
Thermal stability performance of anisotropic conductive film at different bonding temperatures. |
Microelectronics Reliability |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan |
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. |
Microelectronics Reliability |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So |
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. |
Microelectronics Reliability |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu |
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. |
Microelectronics Reliability |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | N. H. Yeung, Victor Lau, Y. C. Chan |
Bias-HAST on tape ball grid array (TBGA) test pattern. |
Microelectronics Reliability |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | Rashed Adnan Islam, Y. C. Chan |
Effect of microwave preheating on the bonding performance of flip chip on flex joint. |
Microelectronics Reliability |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | C. W. Tan, Y. C. Chan, N. H. Yeung |
Behaviour of anisotropic conductive joints under mechanical loading. |
Microelectronics Reliability |
2003 |
DBLP DOI BibTeX RDF |
|
| 1 | M. N. Islam, Y. C. Chan, Ahmed Sharif, M. O. Alam |
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. |
Microelectronics Reliability |
2003 |
DBLP DOI BibTeX RDF |
|
| 1 | Chunyan Yin, M. O. Alam, Y. C. Chan, Chris Bailey, Hua Lu 0003 |
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. |
Microelectronics Reliability |
2003 |
DBLP DOI BibTeX RDF |
|
| 1 | J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu |
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. |
Microelectronics Reliability |
2003 |
DBLP DOI BibTeX RDF |
|
| 1 | C. W. Tan, Y. C. Chan, N. H. Yeung |
Effect of autoclave test on anisotropic conductive joints. |
Microelectronics Reliability |
2003 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. C. Chan, D. Y. Luk |
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. |
Microelectronics Reliability |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | C. F. Luk, Y. C. Chan, K. C. Hung |
Application of adhesive bonding techniques in hard disk drive head assembly. |
Microelectronics Reliability |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | C. F. Luk, Y. C. Chan, K. C. Hung |
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. |
Microelectronics Reliability |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | M. O. Alam, Y. C. Chan, K. C. Hung |
Reliability study of the electroless Ni-P layer against solder alloy. |
Microelectronics Reliability |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan |
No-flow underfill flip chip assembly--an experimental and modeling analysis. |
Microelectronics Reliability |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. C. Chan, D. Y. Luk |
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. |
Microelectronics Reliability |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. W. Chiu, Y. C. Chan, S. M. Lui |
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. |
Microelectronics Reliability |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | S. H. Fan, Y. C. Chan |
Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications. |
Microelectronics Reliability |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. C. Chan, P. L. Tu, K. C. Hung |
Study of the self-alignment of no-flow underfill for micro-BGA assembly. |
Microelectronics Reliability |
2001 |
DBLP DOI BibTeX RDF |
|
| 1 | P. L. Tu, Y. C. Chan, K. C. Hung |
Reliability of microBGA assembly using no-flow underfill. |
Microelectronics Reliability |
2001 |
DBLP DOI BibTeX RDF |
|
| 1 | P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai |
Study of micro-BGA solder joint reliability. |
Microelectronics Reliability |
2001 |
DBLP DOI BibTeX RDF |
|
| 1 | Y. C. Chan |
FORTLOG = Fortran + Logique. |
SPLT |
1985 |
DBLP BibTeX RDF |
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