| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 1 | Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai |
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation.  |
Microelectronics Reliability  |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai |
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Cheng-Yi Liu, S.-W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai |
Reliability of high-power LED packaging and assembly. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee |
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. |
Microelectronics Reliability |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Michael Mayer, Yi-Shao Lai |
Copper Wire Bonding. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai |
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Ming-Jhang Wu, Hua-Chiang Wen, Shyh-Chi Wu, Ping-Feng Yang, Yi-Shao Lai, Wen-Kuang Hsu, Wen-Fa Wu, Chang-Pin Chou |
Evaluating nanotribological behavior of annealing Si0.8Ge0.2/Si films. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai |
Characteristic of copper wire and transient analysis on wirebonding process. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Jiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C. R. Kao |
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | M. Y. Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai |
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai |
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Bernd K. Appelt, Andy Tseng, Chun-Hsiung Chen, Yi-Shao Lai |
Fine pitch copper wire bonding in high volume production. |
Microelectronics Reliability |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Tong Yan Tee, Xuejun Fan, Yi-Shao Lai |
Advances in Wafer Level Packaging (WLP). |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Jiunn Chen, Yi-Shao Lai, Chueh-An Hsieh, Chia Yi Hu |
Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Bo-Ching He, Chun-Hu Cheng, Hua-Chiang Wen, Yi-Shao Lai, Ping-Feng Yang, Meng-Hung Lin, Wen-Fa Wu, Chang-Pin Chou |
Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Hao-Yuan Chang, Wen-Fung Pan, Meng-Kai Shih, Yi-Shao Lai |
Geometric design for ultra-long needle probe card for digital light processing wafer testing. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere |
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Bo-Ching He, Hua-Chiang Wen, Meng-Hung Lin, Yi-Shao Lai, Wen-Fa Wu, Chang-Pin Chou |
Effect of annealing treatment and nanomechanical properties for multilayer Si0.8Ge0.2-Si films. |
Microelectronics Reliability |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Ho-Ming Tong, King-Ning Tu |
Recent research advances in Pb-free solders. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai |
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai |
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan |
Alloying modification of Sn-Ag-Cu solders by manganese and titanium. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | Jiunn Chen, Yi-Shao Lai |
Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases. |
Microelectronics Reliability |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen |
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. |
Microelectronics Reliability |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin |
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. |
Microelectronics Reliability |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen |
Finite element model verification for packaged printed circuit board by experimental modal analysis. |
Microelectronics Reliability |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Lin Yeh, Yi-Shao Lai |
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. |
Microelectronics Reliability |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh |
Effects of different drop test conditions on board-level reliability of chip-scale packages. |
Microelectronics Reliability |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Ping-Feng Yang, Hua-Chiang Wen, Sheng-Rui Jian, Yi-Shao Lai, Sean Wu, Rong-Sheng Chen |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering. |
Microelectronics Reliability |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Tong Hong Wang |
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen |
Empirical correlation between package-level ball impact test and board-level drop reliability. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen |
Cyclic bending reliability of wafer-level chip-scale packages. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai |
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu |
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen |
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh |
Evaluation of solder joint strengths under ball impact test. |
Microelectronics Reliability |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai |
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Chin-Li Kao |
Characteristics of current crowding in flip-chip solder bumps. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh |
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Lin Yeh, Yi-Shao Lai |
Transient fracturing of solder joints subjected to displacement-controlled impact loads. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Lin Yeh, Yi-Shao Lai |
Support excitation scheme for transient analysis of JEDEC board-level drop test. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Chin-Li Kao |
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao |
Evaluation of board-level reliability of electronic packages under consecutive drops. |
Microelectronics Reliability |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Yi-Shao Lai, Tong Hong Wang |
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. |
Microelectronics Reliability |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | Chang-Lin Yeh, Yi-Shao Lai |
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. |
Microelectronics Reliability |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | Ray-Shyan Wu, Yi-Shao Lai |
An Observation on Fractal Characteristics of Individual River Plan Forms. |
Fractals in the Natural and Applied Sciences |
1993 |
DBLP BibTeX RDF |
|
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