Search results for "interconnect reliability"

Hits ?▲	Authors	Title	Venue	Year	Link	Author keywords
2	Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor	A tool flow for predicting system level timing failures due to interconnect reliability degradation.	ACM Great Lakes Symposium on VLSI	2008	DBLP DOI BibTeX RDF	system degradation, system level failures, interconnect reliability
1	Ming Yao, Xuliang Zhang, Chaoyang Zhao, Jianguo Ma	Self-consistent design issues for high frequency Cu interconnect reliability incorporating skin effect.	Microelectronics Reliability	2011	DBLP DOI BibTeX RDF
1	Feifei He, Cher Ming Tan	Circuit level interconnect reliability study using 3D circuit model.	Microelectronics Reliability	2010	DBLP DOI BibTeX RDF
1	J. J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang	Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull.	Microelectronics Reliability	2009	DBLP DOI BibTeX RDF
1	Arthur Nieuwoudt, Yehia Massoud	Investigating the Design, Performance, and Reliability of Multi-Walled Carbon Nanotube Interconnect.	ISQED	2008	DBLP DOI BibTeX RDF	Mutli-walled carbon nanotubes, nanotube interconnect, interconnect, interconnect reliability
1	Zhijian Lu, Wei Huang, Mircea R. Stan, Kevin Skadron, John Lach	Interconnect Lifetime Prediction for Reliability-Aware Systems.	IEEE Trans. VLSI Syst.	2007	DBLP DOI BibTeX RDF
1	Jens Lienig	introduction to electromigration-aware physical design.	ISPD	2006	DBLP DOI BibTeX RDF	interconnect, layout, physical design, electromigration, current density, interconnect reliability
1	Xiangdong Xuan, Adit D. Singh, Abhijit Chatterjee	Lifetime Prediction and Design-for-Reliability of IC Interconnections with Electromigration Induced Degradation in the Presence of Manufacturing Defects.	J. Electronic Testing	2006	DBLP DOI BibTeX RDF	IC reliability, reliability simulation, design for reliability, interconnect, electromigration, defect modeling
1	Jens Lienig	Interconnect and current density stress: an introduction to electromigration-aware design.	SLIP	2005	DBLP DOI BibTeX RDF	interconnect, layout, physical design, electromigration, current density, interconnect reliability
1	Syed M. Alam, Donald E. Troxel, Carl V. Thompson	Thermal aware cell-based full-chip electromigration reliability analysis.	ACM Great Lakes Symposium on VLSI	2005	DBLP DOI BibTeX RDF	IC thermal analysis, full-chip reliability, reliability aware design, reliability characterization, electromigration
1	N. Venkateswaran, S. Balaji, V. Sridhar	Fault tolerant bus architecture for deep submicron based processors.	SIGARCH Computer Architecture News	2005	DBLP DOI BibTeX RDF	deep submicron technology, fault tolerance, interconnect, electromigration
1	Goeran Jerke, Jens Lienig, Jürgen Scheible	Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs.	DAC	2004	DBLP DOI BibTeX RDF	decompaction, layout decomposition, physical design, compaction, electromigration, interconnect reliability
1	Zhijian Lu, Wei Huang, John Lach, Mircea R. Stan, Kevin Skadron	Interconnect lifetime prediction under dynamic stress for reliability-aware design.	ICCAD	2004	DBLP DOI BibTeX RDF
1	Ting-Yuan Wang, Charlie Chung-Ping Chen	SPICE-Compatible Thermal Simulation with Lumped Circuit Modeling for Thermal Reliability Analysis Based on Modeling Order Reduction.	ISQED	2004	DBLP DOI BibTeX RDF