|
|
|
|
Venues (Conferences, Journals, ...)
|
|
|
GrowBag graphs for keyword ? (Num. hits/coverage)
Group by:
The graphs summarize 46 occurrences of 33 keywords
|
|
|
|
|
Results
Found 67 publication records. Showing 67 according to the selection in the facets
| Hits ?▲ |
Authors |
Title |
Venue |
Year |
Link |
Author keywords |
| 2 | Joseph Nayfach-Battilana, Jose Renau |
SOI, interconnect, package, and mainboard thermal characterization.  |
ISLPED  |
2009 |
DBLP DOI BibTeX RDF |
SOI modeling, package modeling, thermal modeling, interconnect modeling |
| 2 | Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller |
Design and CAD for 3D integrated circuits.  |
DAC  |
2008 |
DBLP DOI BibTeX RDF |
thermal modeling, TSV, through silicon via, 3DIC |
| 2 | Jiang Lin, Hongzhong Zheng, Zhichun Zhu, Howard David, Zhao Zhang |
Thermal modeling and management of DRAM memory systems.  |
ISCA  |
2007 |
DBLP DOI BibTeX RDF |
thermal management, thermal modeling, DRAM memories |
| 2 | Jeffrey Rambo, Yogendra Joshi |
Modeling of data center airflow and heat transfer: State of the art and future trends.  |
Distributed and Parallel Databases  |
2007 |
DBLP DOI BibTeX RDF |
Data center, Thermal modeling, Reduced order models |
| 2 | Wei Huang, Shougata Ghosh, Sivakumar Velusamy, Karthik Sankaranarayanan, Kevin Skadron, Mircea R. Stan |
HotSpot: A Compact Thermal Modeling Methodology for Early-Stage VLSI Design.  |
IEEE Trans. VLSI Syst.  |
2006 |
DBLP DOI BibTeX RDF |
|
| 2 | Li Shang, Li-Shiuan Peh, Amit Kumar 0002, Niraj K. Jha |
Temperature-Aware On-Chip Networks.  |
IEEE Micro  |
2006 |
DBLP DOI BibTeX RDF |
Temperature-aware, thermal management, thermal modeling, on-chip networks, thermal, simulation framework |
| 2 | Michel Hell, Luiz Secco, Pyramo Costa Jr., Fernando A. C. Gomide |
Recurrent Neural Approaches for Power Transformers Thermal Modeling.  |
PReMI  |
2005 |
DBLP DOI BibTeX RDF |
|
| 2 | Peng Li, Lawrence T. Pileggi, Mehdi Asheghi, Rajit Chandra |
Efficient full-chip thermal modeling and analysis.  |
ICCAD  |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | Thom Jefferson A. Eguia, Sheldon X.-D. Tan, Ruijing Shen, Duo Li, Eduardo H. Pacheco, Murli Tirumala, Lingli Wang |
General Parameterized Thermal Modeling for High-Performance Microprocessor Design.  |
IEEE Trans. VLSI Syst.  |
2012 |
DBLP DOI BibTeX RDF |
|
| 1 | Da-Cheng Juan, Yi-Lin Chuang, Diana Marculescu, Yao-Wen Chang |
Statistical thermal modeling and optimization considering leakage power variations.  |
DATE  |
2012 |
DBLP BibTeX RDF |
|
| 1 | Pablo Garcia Del Valle, David Atienza |
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling.  |
Microelectronics Journal  |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Herman Oprins, A. Srinivasan, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng |
Fine grain thermal modeling and experimental validation of 3D-ICs.  |
Microelectronics Journal  |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Hitoshi Mizunuma, Yi-Chang Lu, Chia-Lin Yang |
Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling.  |
IEEE Trans. on CAD of Integrated Circuits and Systems  |
2011 |
DBLP DOI BibTeX RDF |
|
| 1 | Vladimir Kosel, Robert Illing, Michael Glavanovics, Alexander Satka |
Non-linear thermal modeling of DMOS transistor and validation using electrical measurements and FEM simulations.  |
Microelectronics Journal  |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Mirko Bernardoni, Nicola Delmonte, Paolo Cova, Roberto Menozzi |
Thermal modeling of planar transformer for switching power converters.  |
Microelectronics Reliability  |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | José L. Ayala, Arvind Sridhar, David Cuesta |
Thermal modeling and analysis of 3D multi-processor chips.  |
Integration  |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Thom Jefferson A. Eguia, Sheldon X.-D. Tan, Ruijing Shen, Eduardo H. Pacheco, Murli Tirumala |
General behavioral thermal modeling and characterization for multi-core microprocessor design.  |
DATE  |
2010 |
DBLP BibTeX RDF |
|
| 1 | Michael Jonas, Georgios Varsamopoulos, Sandeep K. S. Gupta |
Non-invasive Thermal Modeling Techniques Using Ambient Sensors for Greening Data Centers.  |
ICPP Workshops  |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Arvind Sridhar, Alessandro Vincenzi, Martino Ruggiero, Thomas Brunschwiler, David Atienza |
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling.  |
ICCAD  |
2010 |
DBLP DOI BibTeX RDF |
|
| 1 | Azalia Mirhoseini, Yousra Alkabani, Farinaz Koushanfar |
Real time emulations: foundation and applications.  |
DAC  |
2010 |
DBLP DOI BibTeX RDF |
real-time emultion, thermal modeling |
| 1 | Francisco J. Mesa-Martinez, Ehsan K. Ardestani, Jose Renau |
Characterizing processor thermal behavior.  |
ASPLOS  |
2010 |
DBLP DOI BibTeX RDF |
microarchitecture, temperature, thermal simulation |
| 1 | Wei Liu, Andrea Calimera, Alberto Nannarelli, Enrico Macii, Massimo Poncino |
On-chip Thermal Modeling Based on SPICE Simulation.  |
PATMOS  |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | Ayse Kivilcim Coskun, José L. Ayala, David Atienza, Tajana Simunic Rosing |
Thermal Modeling and Management of Liquid-Cooled 3D Stacked Architectures.  |
VLSI-SoC  |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | Dragica Vasileska, Ashwin Ashok, O. Hartin, Stephen Marshall Goodnick |
Thermal Modeling of GaN HEMTs.  |
LSSC  |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | Hitoshi Mizunuma, Chia-Lin Yang, Yi-Chang Lu |
Thermal modeling for 3D-ICs with integrated microchannel cooling.  |
ICCAD  |
2009 |
DBLP BibTeX RDF |
|
| 1 | Kunal P. Ganeshpure, Ilia Polian, Sandip Kundu, Bernd Becker |
Reducing temperature variability by routing heat pipes.  |
ACM Great Lakes Symposium on VLSI  |
2009 |
DBLP DOI BibTeX RDF |
reliability, physical design, thermal modeling, thermal simulation |
| 1 | José L. Ayala, Arvind Sridhar, Vinod Pangracious, David Atienza, Yusuf Leblebici |
Through Silicon Via-Based Grid for Thermal Control in 3D Chips.  |
NanoNet  |
2009 |
DBLP DOI BibTeX RDF |
|
| 1 | E. R. Heller, A. Crespo |
Electro-thermal modeling of multifinger AlGaN/GaN HEMT device operation including thermal substrate effects.  |
Microelectronics Reliability  |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | P. Cova, Nicola Delmonte, Roberto Menozzi |
Thermal modeling of high frequency DC-DC switching modules: Electromagnetic and thermal simulation of magnetic components.  |
Microelectronics Reliability  |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | R. Hosseini, M. Nourolahi, G. B. Gharehpetian |
Determination of OD cooling system parameters based on thermal modeling of power transformer winding.  |
Simulation Modelling Practice and Theory  |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Li Jiang, Wang Zhan, Murray H. Loew |
Dynamic Thermal Modeling of the Normal and Tumorous Breast under Elastic Deformation.  |
MICCAI  |
2008 |
DBLP DOI BibTeX RDF |
dynamic infrared imaging, thermal-elastic modeling, breast cancer |
| 1 | Grzegorz Janczyk, Tomasz Bieniek |
The HDL and FE Thermal Modeling of Heterogeneous Systems.  |
DDECS  |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Jeonghwan Choi, Youngjae Kim, Anand Sivasubramaniam, Jelena Srebric, Qian Wang, Joonwon Lee |
A CFD-Based Tool for Studying Temperature in Rack-Mounted Servers.  |
IEEE Trans. Computers  |
2008 |
DBLP DOI BibTeX RDF |
|
| 1 | Darrell Wesley Johnson, Jerrell R. Ballard, David Leese, Owen J. Eslinger |
Apparent soil thermal diffusivity determinatior method for use in thermal modeling.  |
IGARSS  |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Shilpa Bhoj, Dinesh Bhatia |
Thermal Modeling and Temperature Driven Placement for FPGAs.  |
ISCAS  |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu |
3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method.  |
ISQED  |
2007 |
DBLP DOI BibTeX RDF |
3DFFT, Simulation, CAD, Fourier Transform, Thermal Modeling, Multi-layer, Green's Function |
| 1 | Fernando Pardo, P. López, Diego Cabello |
Soft-Hard 3D FD-TD Solver for Non Destructive Evaluation.  |
FPL  |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Michel Hell, Pyramo Costa Jr., Fernando A. C. Gomide |
New Neurofuzzy Training Procedure Based on Participatory Learning Paradigm.  |
FUZZ-IEEE  |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Jeonghwan Choi, Youngjae Kim, Anand Sivasubramaniam, Jelena Srebric, Qian Wang, Joonwon Lee |
Modeling and Managing Thermal Profiles of Rack-mounted Servers with ThermoStat.  |
HPCA  |
2007 |
DBLP DOI BibTeX RDF |
|
| 1 | Yonghong Yang, Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert P. Dick |
Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design.  |
ICCAD  |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Brian Swahn, Soha Hassoun |
Gate sizing: finFETs vs 32nm bulk MOSFETs.  |
DAC  |
2006 |
DBLP DOI BibTeX RDF |
gate sizing, thermal modeling, FinFET |
| 1 | Hao Yu, Joanna Ho, Lei He |
Simultaneous power and thermal integrity driven via stapling in 3D ICs.  |
ICCAD  |
2006 |
DBLP DOI BibTeX RDF |
structured and parameterized model order reduction, thermal modeling and management |
| 1 | Jason Cong, Ashok Jagannathan, Yuchun Ma, Glenn Reinman, Jie Wei, Yan Zhang |
An automated design flow for 3D microarchitecture evaluation.  |
ASP-DAC  |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Zhenyu (Peter) Gu, Yonghong Yang, Jia Wang, Robert P. Dick, Li Shang |
TAPHS: thermal-aware unified physical-level and high-level synthesis.  |
ASP-DAC  |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Venumadhav Korampally, Shantanu Bhattacharya, Yuanfang Gao, Sheila A. Grant, Steven B. Kleiboeker, Keshab Gangopadhyay, Jinglu Tan, Shubhra Gangopadhyay |
Optimization of Fabrication Process for a PDMS-SOG-Silicon Based PCR Micro Chip through System Identification Techniques.  |
CBMS  |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | S. Sharifian Attar, Mustapha Chérif-Eddine Yagoub, F. Mohammadi |
New Electro-Thermal Integrated Circuit Modeling using Coupling of Simulators.  |
CCECE  |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Geraldo Souza Reis Jr., Paulo E. M. Almeida |
Modified Fuzzy-CMAC Networks with Clustering-based Structure.  |
IJCNN  |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Peng Li, Lawrence T. Pileggi, Mehdi Asheghi, Rajit Chandra |
IC thermal simulation and modeling via efficient multigrid-based approaches.  |
IEEE Trans. on CAD of Integrated Circuits and Systems  |
2006 |
DBLP DOI BibTeX RDF |
|
| 1 | Krishnan Sundaresan, Nihar R. Mahapatra |
Accurate Energy Dissipation and Thermal Modeling for Nanometer-Scale Buses.  |
HPCA  |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | Janet Meiling Wang, Bharat Srinivas, Dongsheng Ma, Charlie Chung-Ping Chen, Jun Li |
System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS).  |
ICCAD  |
2005 |
DBLP BibTeX RDF |
|
| 1 | Sivakumar Velusamy, Wei Huang, John Lach, Mircea R. Stan, Kevin Skadron |
Monitoring Temperature in FPGA based SoCs.  |
ICCD  |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | Rajiv V. Joshi, S. S. Kang, N. Zamdmar, A. Mocuta, Ching-Te Chuang, J. A. Pascual-Gutiérrez |
Direct Temperature Measurement for VLSI Circuits and 3-D Modeling of Self-Heating in Sub-0.13 mum SOI Technologies.  |
VLSI Design  |
2005 |
DBLP DOI BibTeX RDF |
|
| 1 | Satbir S. Madra |
Role of carrier depletion effects and material properties in advanced microscale thermal modeling of N-GaInP-Si/p-GaAs-C heterojunction bipolar transistor (HBT) devices.  |
Microelectronics Reliability  |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | Li Shang, Li-Shiuan Peh, Amit Kumar 0002, Niraj K. Jha |
Thermal Modeling, Characterization and Management of On-Chip Networks.  |
MICRO  |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | Wei Huang, Mircea R. Stan, Kevin Skadron, Karthik Sankaranarayanan, Shougata Ghosh, Sivakumar Velusamy |
Compact thermal modeling for temperature-aware design.  |
DAC  |
2004 |
DBLP DOI BibTeX RDF |
temperature-aware computing, reliability, leakage, thermal model, temperature-aware design, power-aware design |
| 1 | Weng Khuen Ho, Arthur Tay, Ying Zhou, Kai Yang, Ni Hu |
Detection of wafer warpages during thermal processing in microlithography.  |
ICARCV  |
2004 |
DBLP DOI BibTeX RDF |
|
| 1 | Mario R. Casu, Mariagrazia Graziano, Guido Masera, Gianluca Piccinini, Maurizio Zamboni |
Coupled electro-thermal modeling and optimization of clock networks.  |
Microelectronics Journal  |
2003 |
DBLP DOI BibTeX RDF |
|
| 1 | Paiboon Tangyunyong |
Thermal modeling of localized laser heating in multi-level interconnects.  |
Microelectronics Reliability  |
2003 |
DBLP DOI BibTeX RDF |
|
| 1 | Márta Rencz, Vladimir Székely, András Poppe |
A Fast Algorithm for the Layout Based Electro-Thermal Simulation.  |
DATE  |
2003 |
DBLP DOI BibTeX RDF |
|
| 1 | George Cai, Ashutosh S. Dhodapkar, James E. Smith |
Integrated Performance, Power, and Thermal Modeling.  |
Journal of Circuits, Systems, and Computers  |
2002 |
DBLP DOI BibTeX RDF |
|
| 1 | Kevin Skadron, Tarek F. Abdelzaher, Mircea R. Stan |
Control-Theoretic Techniques and Thermal-RC Modeling for Accurate and Localized Dynamic Thermal Management.  |
HPCA  |
2002 |
DBLP DOI BibTeX RDF |
thermal modeling and management, formal feedback control theory, performance, power, microprocessors |
| 1 | D. G. Walker, T. S. Fisher, J. Liu, Ronald D. Schrimpf |
Thermal modeling of single event burnout failure in semiconductor power devices.  |
Microelectronics Reliability  |
2001 |
DBLP DOI BibTeX RDF |
|
| 1 | Danqing Chen, Erhong Li, Elyse Rosenbaum, Sung-Mo Kang |
Interconnect thermal modeling for accurate simulation of circuittiming and reliability.  |
IEEE Trans. on CAD of Integrated Circuits and Systems  |
2000 |
DBLP DOI BibTeX RDF |
|
| 1 | Danqing Chen, Erhong Li, Elyse Rosenbaum, Sung-Mo Kang |
Interconnect thermal modeling for determining design limits on current density.  |
ISPD  |
1999 |
DBLP DOI BibTeX RDF |
|
| 1 | S. Wünsche, C. Clauss, P. Schwarz, Frank Winkler |
Electro-thermal circuit simulation using simulator coupling.  |
IEEE Trans. VLSI Syst.  |
1997 |
DBLP DOI BibTeX RDF |
|
| 1 | Arif Merchant, Benjamin Melamed, Eugen Schenfeld, Bhaskar Sengupta |
Analysis of a Control Mechanism for a Variable Speed Processor.  |
IEEE Trans. Computers  |
1996 |
DBLP DOI BibTeX RDF |
Variable speed processor, throughput gain, performance analysis, Markov processes, thermal modeling |
| 1 | H. Victor Mahaney |
Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC).  |
IBM Journal of Research and Development  |
1993 |
DBLP BibTeX RDF |
|
Displaying result #1 - #67 of 67 (100 per page; Change: )
|
|