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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/HuangHLCH11>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/Fei-Yi_Hung>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/Hao-Wen_Hsueh>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/I.-Ting_Huang>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/Li-Hui_Chen>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/Truan-Sheng_Lui>
foaf:homepage <http://dx.doi.org/10.1016%2Fj.microrel.2010.04.007>
foaf:homepage <http://dx.doi.org/10.1016/j.microrel.2010.04.007>
dc:identifier DBLP journals/mr/HuangHLCH11 (xsd:string)
dc:identifier DOI 10.1016%2Fj.microrel.2010.04.007 (xsd:string)
dcterms:issued 2011 (xsd:gYear)
swrc:journal <http://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label A study on the tensile fracture mechanism of 15 μm copper wire after EFO process. (xsd:string)
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/Fei-Yi_Hung>
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/Hao-Wen_Hsueh>
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/I.-Ting_Huang>
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/Li-Hui_Chen>
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/Truan-Sheng_Lui>
swrc:number 1 (xsd:string)
swrc:pages 25-29 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/HuangHLCH11/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/HuangHLCH11>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr51.html#HuangHLCH11>
rdfs:seeAlso <http://dx.doi.org/10.1016/j.microrel.2010.04.007>
dc:title A study on the tensile fracture mechanism of 15 μm copper wire after EFO process. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 51 (xsd:string)