Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling.
Resource URI: http://dblp.l3s.de/d2r/resource/publications/journals/mr/JacquesCBSLG12
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dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/journals/mr/JacquesCBSLG12
>
dc:
creator
<
http://dblp.l3s.de/d2r/resource/authors/A._Caldeira
>
dc:
creator
<
http://dblp.l3s.de/d2r/resource/authors/A._Schellmanns
>
dc:
creator
<
http://dblp.l3s.de/d2r/resource/authors/L._Gonthier
>
dc:
creator
<
http://dblp.l3s.de/d2r/resource/authors/N._Batut
>
dc:
creator
<
http://dblp.l3s.de/d2r/resource/authors/R._Leroy
>
dc:
creator
<
http://dblp.l3s.de/d2r/resource/authors/S._Jacques
>
foaf:
homepage
<
http://dx.doi.org/10.1016%2Fj.microrel.2011.08.017
>
foaf:
homepage
<
http://dx.doi.org/10.1016/j.microrel.2011.08.017
>
dc:
identifier
DBLP journals/mr/JacquesCBSLG12
(xsd:string)
dc:
identifier
DOI 10.1016%2Fj.microrel.2011.08.017
(xsd:string)
dcterms:
issued
2012
(xsd:gYear)
swrc:
journal
<
http://dblp.l3s.de/d2r/resource/journals/mr
>
rdfs:
label
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling.
(xsd:string)
foaf:
maker
<
http://dblp.l3s.de/d2r/resource/authors/A._Caldeira
>
foaf:
maker
<
http://dblp.l3s.de/d2r/resource/authors/A._Schellmanns
>
foaf:
maker
<
http://dblp.l3s.de/d2r/resource/authors/L._Gonthier
>
foaf:
maker
<
http://dblp.l3s.de/d2r/resource/authors/N._Batut
>
foaf:
maker
<
http://dblp.l3s.de/d2r/resource/authors/R._Leroy
>
foaf:
maker
<
http://dblp.l3s.de/d2r/resource/authors/S._Jacques
>
swrc:
number
1
(xsd:string)
swrc:
pages
212-216
(xsd:string)
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/journals/mr/JacquesCBSLG12/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/journals/mr/JacquesCBSLG12
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/journals/mr/mr52.html#JacquesCBSLG12
>
rdfs:
seeAlso
<
http://dx.doi.org/10.1016/j.microrel.2011.08.017
>
dc:
title
Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:Article
rdf:
type
foaf:Document
swrc:
volume
52
(xsd:string)