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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/journals/mr/TanLAWL12>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/C._S._Tan>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/Dau_Fatt_Lim>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/J._Wei>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/K._C._Leong>
dc:creator <http://dblp.l3s.de/d2r/resource/authors/Xiao_Fang_Ang>
foaf:homepage <http://dx.doi.org/10.1016%2Fj.microrel.2011.04.003>
foaf:homepage <http://dx.doi.org/10.1016/j.microrel.2011.04.003>
dc:identifier DBLP journals/mr/TanLAWL12 (xsd:string)
dc:identifier DOI 10.1016%2Fj.microrel.2011.04.003 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
swrc:journal <http://dblp.l3s.de/d2r/resource/journals/mr>
rdfs:label Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. (xsd:string)
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/C._S._Tan>
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/Dau_Fatt_Lim>
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/J._Wei>
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/K._C._Leong>
foaf:maker <http://dblp.l3s.de/d2r/resource/authors/Xiao_Fang_Ang>
swrc:number 2 (xsd:string)
swrc:pages 321-324 (xsd:string)
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/journals/mr/TanLAWL12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/journals/mr/TanLAWL12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/journals/mr/mr52.html#TanLAWL12>
rdfs:seeAlso <http://dx.doi.org/10.1016/j.microrel.2011.04.003>
dc:title Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:Article
rdf:type foaf:Document
swrc:volume 52 (xsd:string)