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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/CivaleTPJADSTB09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Deniz_Sabuncuoglu_Tezcan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/F._Duval>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Harold_G._G._Philipsen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/P._Jaenen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Philippe_Soussan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rahul_Agarwal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yann_Civale>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Youssef_Travaly>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2009.5306559>
foaf:homepage <https://doi.org/10.1109/3DIC.2009.5306559>
dc:identifier DBLP conf/3dic/CivaleTPJADSTB09 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2009.5306559 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
rdfs:label Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Deniz_Sabuncuoglu_Tezcan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/F._Duval>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Harold_G._G._Philipsen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/P._Jaenen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Philippe_Soussan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rahul_Agarwal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yann_Civale>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Youssef_Travaly>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2009>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/CivaleTPJADSTB09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/CivaleTPJADSTB09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#CivaleTPJADSTB09>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2009.5306559>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document