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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/DubarryAMMMCBA21>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bernard_Aventurier>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Christophe_Dubarry>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ga%E2%88%9A%C4%99lle_Mauguen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lucile_Arnaud>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Maria-Luisa_Calvo-Mu%E2%88%9A%C4%AAoz>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nicolas_Bresson>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/R._Crochemore>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/St%E2%88%9A%C2%A9phane_Moreau>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC52383.2021.9687599>
foaf:homepage <https://doi.org/10.1109/3DIC52383.2021.9687599>
dc:identifier DBLP conf/3dic/DubarryAMMMCBA21 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC52383.2021.9687599 (xsd:string)
dcterms:issued 2021 (xsd:gYear)
rdfs:label 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bernard_Aventurier>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Christophe_Dubarry>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ga%E2%88%9A%C4%99lle_Mauguen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lucile_Arnaud>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Maria-Luisa_Calvo-Mu%E2%88%9A%C4%AAoz>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nicolas_Bresson>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/R._Crochemore>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/St%E2%88%9A%C2%A9phane_Moreau>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2021>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/DubarryAMMMCBA21/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/DubarryAMMMCBA21>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2021.html#DubarryAMMMCBA21>
rdfs:seeAlso <https://doi.org/10.1109/3DIC52383.2021.9687599>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title 3D interconnection using copper direct hybrid bonding for GaN on silicon wafer. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document