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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/GaudinRLTRSWKH10>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Catherine_Tempesta>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Didier_Landru>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Emily_Kinser>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Gregory_Riou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Gweltaz_Gaudin>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ionut_Radu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kevin_Winstel>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mariam_Sadaka>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Robert_Hannon>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2010.5751472>
foaf:homepage <https://doi.org/10.1109/3DIC.2010.5751472>
dc:identifier DBLP conf/3dic/GaudinRLTRSWKH10 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2010.5751472 (xsd:string)
dcterms:issued 2010 (xsd:gYear)
rdfs:label Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Catherine_Tempesta>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Didier_Landru>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Emily_Kinser>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Gregory_Riou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Gweltaz_Gaudin>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ionut_Radu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kevin_Winstel>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mariam_Sadaka>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Robert_Hannon>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2010>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/GaudinRLTRSWKH10/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/GaudinRLTRSWKH10>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2010.html#GaudinRLTRSWKH10>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2010.5751472>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document