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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/HuGLZLT21>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chuan_Seng_Tan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Liangxing_Hu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Michael_Joo_Zhong_Lim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Peng_Zhao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Simon_Chun_Kiat_Goh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu_Dian_Lim>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC52383.2021.9687609>
foaf:homepage <https://doi.org/10.1109/3DIC52383.2021.9687609>
dc:identifier DBLP conf/3dic/HuGLZLT21 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC52383.2021.9687609 (xsd:string)
dcterms:issued 2021 (xsd:gYear)
rdfs:label Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chuan_Seng_Tan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Liangxing_Hu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Michael_Joo_Zhong_Lim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Peng_Zhao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Simon_Chun_Kiat_Goh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu_Dian_Lim>
swrc:pages 1-5 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2021>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/HuGLZLT21/dblp>
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2021.html#HuGLZLT21>
rdfs:seeAlso <https://doi.org/10.1109/3DIC52383.2021.9687609>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document