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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/JoblotFHJCGAFCFLC13>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Alexis_Farcy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Amadine_Jouve>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Arnaud_Garnier>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/C._Ferrandon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/C._Laviron>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fran%E2%88%9A%C3%9Fois_de_Crecy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/J.-P._Colonna>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/M._Argoud>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nicolas_Hotellier>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/R._Franiatte>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S%E2%88%9A%C2%A9verine_Cheramy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sylvain_Joblot>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2013.6702394>
foaf:homepage <https://doi.org/10.1109/3DIC.2013.6702394>
dc:identifier DBLP conf/3dic/JoblotFHJCGAFCFLC13 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2013.6702394 (xsd:string)
dcterms:issued 2013 (xsd:gYear)
rdfs:label Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Alexis_Farcy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Amadine_Jouve>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Arnaud_Garnier>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/C._Ferrandon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/C._Laviron>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fran%E2%88%9A%C3%9Fois_de_Crecy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J.-P._Colonna>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/M._Argoud>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nicolas_Hotellier>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/R._Franiatte>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S%E2%88%9A%C2%A9verine_Cheramy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sylvain_Joblot>
swrc:pages 1-7 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2013>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/JoblotFHJCGAFCFLC13/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/JoblotFHJCGAFCFLC13>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#JoblotFHJCGAFCFLC13>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2013.6702394>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document