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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/JouveHBDPBDH09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Amadine_Jouve>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/D._Blumenshine>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_Henry>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dongshun_Bai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/J._Diaz>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/JoElle_Dachsteiner>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rama_Puligadda>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wenbin_Hong>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2009.5306523>
foaf:homepage <https://doi.org/10.1109/3DIC.2009.5306523>
dc:identifier DBLP conf/3dic/JouveHBDPBDH09 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2009.5306523 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
rdfs:label Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Amadine_Jouve>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/D._Blumenshine>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/David_Henry>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dongshun_Bai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J._Diaz>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/JoElle_Dachsteiner>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rama_Puligadda>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wenbin_Hong>
swrc:pages 1-5 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2009>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/JouveHBDPBDH09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/JouveHBDPBDH09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#JouveHBDPBDH09>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2009.5306523>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Material improvement for ultrathin-wafer handling in TSV creation and PECVD process. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document