[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/MatsumotoMO14>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiroyuki_Mori>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Keiji_Matsumoto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yasumitsu_Orii>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2014.7152164>
foaf:homepage <https://doi.org/10.1109/3DIC.2014.7152164>
dc:identifier DBLP conf/3dic/MatsumotoMO14 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2014.7152164 (xsd:string)
dcterms:issued 2014 (xsd:gYear)
rdfs:label Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiroyuki_Mori>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Keiji_Matsumoto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yasumitsu_Orii>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2014>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/MatsumotoMO14/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/MatsumotoMO14>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#MatsumotoMO14>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2014.7152164>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Cooling from the bottom side (laminate (substrate) side) of a three-dimensional (3D) chip stack. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document