A 6.9 őľm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections.
Resource URI: https://dblp.l3s.de/d2r/resource/publications/conf/3dic/MiuraSTTTOE19
Home
|
Example Publications
Property
Value
dcterms:
bibliographicCitation
<
http://dblp.uni-trier.de/rec/bibtex/conf/3dic/MiuraSTTTOE19
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Hirotsugu_Takahashi
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Keiji_Tatani
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Masaki_Sakakibara
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Tadayuki_Taura
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Takayuki_Ezaki
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Tsukasa_Miura
>
dc:
creator
<
https://dblp.l3s.de/d2r/resource/authors/Yusuke_Oike
>
foaf:
homepage
<
http://dx.doi.org/doi.org%2F10.1109%2F3DIC48104.2019.9058832
>
foaf:
homepage
<
https://doi.org/10.1109/3DIC48104.2019.9058832
>
dc:
identifier
DBLP conf/3dic/MiuraSTTTOE19
(xsd:string)
dc:
identifier
DOI doi.org%2F10.1109%2F3DIC48104.2019.9058832
(xsd:string)
dcterms:
issued
2019
(xsd:gYear)
rdfs:
label
A 6.9 őľm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections.
(xsd:string)
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Hirotsugu_Takahashi
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Keiji_Tatani
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Masaki_Sakakibara
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Tadayuki_Taura
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Takayuki_Ezaki
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Tsukasa_Miura
>
foaf:
maker
<
https://dblp.l3s.de/d2r/resource/authors/Yusuke_Oike
>
swrc:
pages
1-2
(xsd:string)
dcterms:
partOf
<
https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2019
>
owl:
sameAs
<
http://bibsonomy.org/uri/bibtexkey/conf/3dic/MiuraSTTTOE19/dblp
>
owl:
sameAs
<
http://dblp.rkbexplorer.com/id/conf/3dic/MiuraSTTTOE19
>
rdfs:
seeAlso
<
http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#MiuraSTTTOE19
>
rdfs:
seeAlso
<
https://doi.org/10.1109/3DIC48104.2019.9058832
>
swrc:
series
<
https://dblp.l3s.de/d2r/resource/conferences/3dic
>
dc:
title
A 6.9 őľm Pixel-Pitch 3D Stacked Global Shutter CMOS Image Sensor with 3M Cu-Cu connections.
(xsd:string)
dc:
type
<
http://purl.org/dc/dcmitype/Text
>
rdf:
type
swrc:InProceedings
rdf:
type
foaf:Document