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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/MiwaLLKKFT19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hisashi_Kino>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kousei_Kumahara>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rui_Liang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sungho_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Takafumi_Fukushima>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tetsu_Tanaka>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yuki_Miwa>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC48104.2019.9058841>
foaf:homepage <https://doi.org/10.1109/3DIC48104.2019.9058841>
dc:identifier DBLP conf/3dic/MiwaLLKKFT19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC48104.2019.9058841 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
rdfs:label Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hisashi_Kino>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kousei_Kumahara>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rui_Liang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sungho_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Takafumi_Fukushima>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tetsu_Tanaka>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yuki_Miwa>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2019>
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owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/MiwaLLKKFT19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#MiwaLLKKFT19>
rdfs:seeAlso <https://doi.org/10.1109/3DIC48104.2019.9058841>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document