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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/NaeimYCBDSBCPBM23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Antoine_Dekeyser>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Dragomir_Milojevic>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Geert_Van_der_Plas>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Giuliano_Sisto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hanqi_Yang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Mohamed_Naeim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Moritz_Brunion>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Pinhong_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rong_Bao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rongmei_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC57175.2023.10155075>
foaf:homepage <https://doi.org/10.1109/3DIC57175.2023.10155075>
dc:identifier DBLP conf/3dic/NaeimYCBDSBCPBM23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC57175.2023.10155075 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Antoine_Dekeyser>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Dragomir_Milojevic>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Eric_Beyne>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Geert_Van_der_Plas>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Giuliano_Sisto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hanqi_Yang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Mohamed_Naeim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Moritz_Brunion>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Pinhong_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rong_Bao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rongmei_Chen>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/NaeimYCBDSBCPBM23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/NaeimYCBDSBCPBM23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2023.html#NaeimYCBDSBCPBM23>
rdfs:seeAlso <https://doi.org/10.1109/3DIC57175.2023.10155075>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document