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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/NanbaraOHYL15>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Akihiro_Odoriba>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hiroyuki_Yotsuyanagi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kosuke_Nanbara>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Masaki_Hashizume>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shyue-Kung_Lu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2015.7334592>
foaf:homepage <https://doi.org/10.1109/3DIC.2015.7334592>
dc:identifier DBLP conf/3dic/NanbaraOHYL15 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2015.7334592 (xsd:string)
dcterms:issued 2015 (xsd:gYear)
rdfs:label Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Akihiro_Odoriba>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hiroyuki_Yotsuyanagi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kosuke_Nanbara>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Masaki_Hashizume>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shyue-Kung_Lu>
swrc:pages TS8.22.1-TS8.22.5 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2015>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/NanbaraOHYL15/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/NanbaraOHYL15>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#NanbaraOHYL15>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2015.7334592>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Electrical interconnect test of 3D ICs made of dies without ESD protection circuits with a built-in test circuit. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document