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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/PrietoCCHCRDRFB16>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Alexis_Farcy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/C._Brunet-Manquiat>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Christian_Chancel>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/G._Romano>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jean-Philippe_Colonna>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Perceval_Coudrain>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/R._Franiatte>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Rafael_Prieto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/S%E2%88%9A%C2%A9verine_Cheramy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sylvain_Dumas>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/V._Rat>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Y._Hallez>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2016.7970038>
foaf:homepage <https://doi.org/10.1109/3DIC.2016.7970038>
dc:identifier DBLP conf/3dic/PrietoCCHCRDRFB16 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2016.7970038 (xsd:string)
dcterms:issued 2016 (xsd:gYear)
rdfs:label Heat spreading packaging solutions for hybrid bonded 3D-ICs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Alexis_Farcy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/C._Brunet-Manquiat>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Christian_Chancel>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/G._Romano>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jean-Philippe_Colonna>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Perceval_Coudrain>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/R._Franiatte>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Rafael_Prieto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/S%E2%88%9A%C2%A9verine_Cheramy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sylvain_Dumas>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/V._Rat>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Y._Hallez>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2016>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/PrietoCCHCRDRFB16/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/PrietoCCHCRDRFB16>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#PrietoCCHCRDRFB16>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2016.7970038>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Heat spreading packaging solutions for hybrid bonded 3D-ICs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document