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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/RajanKMB21>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ankit_Kaul>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Gary_S._May>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Muhannad_S._Bakir>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sreejith_Kochupurackal_Rajan>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC52383.2021.9687618>
foaf:homepage <https://doi.org/10.1109/3DIC52383.2021.9687618>
dc:identifier DBLP conf/3dic/RajanKMB21 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC52383.2021.9687618 (xsd:string)
dcterms:issued 2021 (xsd:gYear)
rdfs:label Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ankit_Kaul>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Gary_S._May>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Muhannad_S._Bakir>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sreejith_Kochupurackal_Rajan>
swrc:pages 1-5 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2021>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/RajanKMB21/dblp>
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2021.html#RajanKMB21>
rdfs:seeAlso <https://doi.org/10.1109/3DIC52383.2021.9687618>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Electrical and Performance Benefits of Advanced Monolithic Cooling for 2.5D Heterogeneous ICs. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document