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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/SukharevKC19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Armen_Kteyan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jun-Ho_Choy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Valeriy_Sukharev>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC48104.2019.9058854>
foaf:homepage <https://doi.org/10.1109/3DIC48104.2019.9058854>
dc:identifier DBLP conf/3dic/SukharevKC19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC48104.2019.9058854 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
rdfs:label An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Armen_Kteyan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jun-Ho_Choy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Valeriy_Sukharev>
swrc:pages 1-6 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2019>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/SukharevKC19/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/SukharevKC19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#SukharevKC19>
rdfs:seeAlso <https://doi.org/10.1109/3DIC48104.2019.9058854>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document