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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/TehCQAOGMSMCWMGD09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_Grant>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/David_Marx>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jamal_Qureshi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kou_Maekawa>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kouichi_Maruyama>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/M._O%27Brien>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Raymond_Caramto>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Russ_Dudley>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sitaram_Arkalgud>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/T._Gilday>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/T._Saito>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Thenappan_Chidambaram>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Wei_Wang_0003>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Weng_Hong_Teh>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2009.5306562>
foaf:homepage <https://doi.org/10.1109/3DIC.2009.5306562>
dc:identifier DBLP conf/3dic/TehCQAOGMSMCWMGD09 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2009.5306562 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
rdfs:label A route towards production-worthy 5 ¬Ķm √ó 25 ¬Ķm and 1 ¬Ķm √ó 20 ¬Ķm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration. (xsd:string)
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foaf:maker <https://dblp.l3s.de/d2r/resource/authors/David_Marx>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jamal_Qureshi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kou_Maekawa>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kouichi_Maruyama>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/M._O%27Brien>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Raymond_Caramto>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Russ_Dudley>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sitaram_Arkalgud>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/T._Gilday>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/T._Saito>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Thenappan_Chidambaram>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Wei_Wang_0003>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Weng_Hong_Teh>
swrc:pages 1-5 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2009>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/TehCQAOGMSMCWMGD09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/TehCQAOGMSMCWMGD09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#TehCQAOGMSMCWMGD09>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2009.5306562>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title A route towards production-worthy 5 ¬Ķm √ó 25 ¬Ķm and 1 ¬Ķm √ó 20 ¬Ķm non-Bosch through-silicon-via (TSV) etch, TSV metrology, and TSV integration. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document