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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/TsaiLC19>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chia-Hsuan_Lee_0003>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kuan-Neng_Chen>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yi-Chieh_Tsai>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC48104.2019.9058877>
foaf:homepage <https://doi.org/10.1109/3DIC48104.2019.9058877>
dc:identifier DBLP conf/3dic/TsaiLC19 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC48104.2019.9058877 (xsd:string)
dcterms:issued 2019 (xsd:gYear)
rdfs:label Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chia-Hsuan_Lee_0003>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kuan-Neng_Chen>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yi-Chieh_Tsai>
swrc:pages 1-4 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2019>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/TsaiLC19/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/TsaiLC19>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2019.html#TsaiLC19>
rdfs:seeAlso <https://doi.org/10.1109/3DIC48104.2019.9058877>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title Investigation of Low Temperature Cu Pillar Eutectic Bonding for 3D Chip Stacking Technology. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document