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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/3dic/WilliamsOMGR09>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Bart_Gordon>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/G._Williams>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/J._Moore>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/J._Rose>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Patrick_O%27Hara>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2F3DIC.2009.5306571>
foaf:homepage <https://doi.org/10.1109/3DIC.2009.5306571>
dc:identifier DBLP conf/3dic/WilliamsOMGR09 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2F3DIC.2009.5306571 (xsd:string)
dcterms:issued 2009 (xsd:gYear)
rdfs:label A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Bart_Gordon>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/G._Williams>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J._Moore>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/J._Rose>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Patrick_O%27Hara>
swrc:pages 1 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/3dic/2009>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/3dic/WilliamsOMGR09/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/3dic/WilliamsOMGR09>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#WilliamsOMGR09>
rdfs:seeAlso <https://doi.org/10.1109/3DIC.2009.5306571>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/3dic>
dc:title A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document