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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/aimech/HsiehCH23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/I-Wen_Hsieh>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shao-Kang_Hung>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu-Chi_Chen>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FAIM46323.2023.10196200>
foaf:homepage <https://doi.org/10.1109/AIM46323.2023.10196200>
dc:identifier DBLP conf/aimech/HsiehCH23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FAIM46323.2023.10196200 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Design and Implementation of Bending Force Sensor Featuring Printed Circuit Board. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/I-Wen_Hsieh>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shao-Kang_Hung>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu-Chi_Chen>
swrc:pages 579-583 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/aimech/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/aimech/HsiehCH23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/aimech/HsiehCH23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/aimech/aim2023.html#HsiehCH23>
rdfs:seeAlso <https://doi.org/10.1109/AIM46323.2023.10196200>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/aimech>
dc:title Design and Implementation of Bending Force Sensor Featuring Printed Circuit Board. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document