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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/apwcs/LiuYW10>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jian-Bo_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jun_Liu_0046>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ming-xin_Yang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FAPWCS.2010.22>
foaf:homepage <https://doi.org/10.1109/APWCS.2010.22>
dc:identifier DBLP conf/apwcs/LiuYW10 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FAPWCS.2010.22 (xsd:string)
dcterms:issued 2010 (xsd:gYear)
rdfs:label Thick Film Integrated Circuit Design of Multi-measurement Module. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jian-Bo_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jun_Liu_0046>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ming-xin_Yang>
swrc:pages 59-62 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/apwcs/2010>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/apwcs/LiuYW10/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/apwcs/LiuYW10>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/apwcs/apwcs2010.html#LiuYW10>
rdfs:seeAlso <https://doi.org/10.1109/APWCS.2010.22>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/apwcs>
dc:subject Thick film integrated circuit, Signal adjustment circuit, Thermocouple, Calibration, Spi (xsd:string)
dc:title Thick Film Integrated Circuit Design of Multi-measurement Module. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document