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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/asap/WangYHA21>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hsuan_Hsiao>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jason_Helge_Anderson>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tianyi_Yu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xinyuan_Wang_0003>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FASAP52443.2021.00043>
foaf:homepage <https://doi.org/10.1109/ASAP52443.2021.00043>
dc:identifier DBLP conf/asap/WangYHA21 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FASAP52443.2021.00043 (xsd:string)
dcterms:issued 2021 (xsd:gYear)
rdfs:label Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hsuan_Hsiao>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jason_Helge_Anderson>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tianyi_Yu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xinyuan_Wang_0003>
swrc:pages 242-249 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/asap/2021>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/asap/WangYHA21/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/asap/WangYHA21>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/asap/asap2021.html#WangYHA21>
rdfs:seeAlso <https://doi.org/10.1109/ASAP52443.2021.00043>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/asap>
dc:title Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document