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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/asicon/WangSGMSCOCC23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/%E2%88%9A%C3%BAmit_Y._Ogras>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/A._Alper_Goksoy>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chaitali_Chakrabarti>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jae-Sun_Seo>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jingbo_Sun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Sumit_K._Mandal>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Vidya_A._Chhabria>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu_Cao_0001>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zhenyu_Wang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FASICON58565.2023.10396377>
foaf:homepage <https://doi.org/10.1109/ASICON58565.2023.10396377>
dc:identifier DBLP conf/asicon/WangSGMSCOCC23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FASICON58565.2023.10396377 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/%E2%88%9A%C3%BAmit_Y._Ogras>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/A._Alper_Goksoy>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chaitali_Chakrabarti>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jae-Sun_Seo>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jingbo_Sun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Sumit_K._Mandal>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Vidya_A._Chhabria>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu_Cao_0001>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zhenyu_Wang>
swrc:pages 1-4 (xsd:string)
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rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/asicon/asicon2023.html#WangSGMSCOCC23>
rdfs:seeAlso <https://doi.org/10.1109/ASICON58565.2023.10396377>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/asicon>
dc:title Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document