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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/aspdac/ChiouJCLP23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Chi-Wen_Pan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Hong-Wen_Chiou>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jia-Hao_Jiang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu-Min_Lee>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yu-Teng_Chang>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F3566097.3567911>
foaf:homepage <https://doi.org/10.1145/3566097.3567911>
dc:identifier DBLP conf/aspdac/ChiouJCLP23 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F3566097.3567911 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Chi-Wen_Pan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Hong-Wen_Chiou>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jia-Hao_Jiang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu-Min_Lee>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yu-Teng_Chang>
swrc:pages 7-12 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/aspdac/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/aspdac/ChiouJCLP23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/aspdac/ChiouJCLP23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/aspdac/aspdac2023.html#ChiouJCLP23>
rdfs:seeAlso <https://doi.org/10.1145/3566097.3567911>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/aspdac>
dc:title Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document