[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/asplos/KgilDSBDMRF06>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ali_G._Saidi>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kriszti%E2%88%9A%C2%B0n_Flautner>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Nathan_L._Binkert>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ronald_G._Dreslinski>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Shaun_D%27Souza>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Steven_K._Reinhardt>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Taeho_Kgil>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Trevor_N._Mudge>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1145%2F1168857.1168873>
foaf:homepage <https://doi.org/10.1145/1168857.1168873>
dc:identifier DBLP conf/asplos/KgilDSBDMRF06 (xsd:string)
dc:identifier DOI doi.org%2F10.1145%2F1168857.1168873 (xsd:string)
dcterms:issued 2006 (xsd:gYear)
rdfs:label PicoServer: using 3D stacking technology to enable a compact energy efficient chip multiprocessor. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ali_G._Saidi>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kriszti%E2%88%9A%C2%B0n_Flautner>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Nathan_L._Binkert>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ronald_G._Dreslinski>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Shaun_D%27Souza>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Steven_K._Reinhardt>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Taeho_Kgil>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Trevor_N._Mudge>
swrc:pages 117-128 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/asplos/2006>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/asplos/KgilDSBDMRF06/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/asplos/KgilDSBDMRF06>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/asplos/asplos2006.html#KgilDSBDMRF06>
rdfs:seeAlso <https://doi.org/10.1145/1168857.1168873>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/asplos>
dc:subject 3D stacking technology, chip multiprocessor, full-system simulation, low power, tier 1 server, web/file/streaming server (xsd:string)
dc:title PicoServer: using 3D stacking technology to enable a compact energy efficient chip multiprocessor. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document