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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/biocas/DawesCJ23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jacob_Dawes>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Matthew_L._Johnston>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tzu-Hsuan_Chou>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FBioCAS58349.2023.10388923>
foaf:homepage <https://doi.org/10.1109/BioCAS58349.2023.10388923>
dc:identifier DBLP conf/biocas/DawesCJ23 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FBioCAS58349.2023.10388923 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jacob_Dawes>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Matthew_L._Johnston>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tzu-Hsuan_Chou>
swrc:pages 1-5 (xsd:string)
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owl:sameAs <http://dblp.rkbexplorer.com/id/conf/biocas/DawesCJ23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/biocas/biocas2023.html#DawesCJ23>
rdfs:seeAlso <https://doi.org/10.1109/BioCAS58349.2023.10388923>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/biocas>
dc:title Lab-on-CMOS Packaging using Wafer-Level Molding and Direct-Write 3D-Printed Interconnects. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document