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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/biostec/JeongKKPKJ11>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Byoung-Joon_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Byung-Hyun_Kwak>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jae-Won_Kim>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Myeong-Hyeok_Jeong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Young-Bae_Park>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Young-Chang_Joo>
dc:identifier DBLP conf/biostec/JeongKKPKJ11 (xsd:string)
dcterms:issued 2011 (xsd:gYear)
rdfs:label Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Byoung-Joon_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Byung-Hyun_Kwak>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jae-Won_Kim>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Myeong-Hyeok_Jeong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Young-Bae_Park>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Young-Chang_Joo>
swrc:pages 311-314 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/biostec/2011bd>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/biostec/JeongKKPKJ11/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/biostec/JeongKKPKJ11>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/biostec/biodevices2011.html#JeongKKPKJ11>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/biostec>
dc:title Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document