[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/bmei/ZhongDYY12>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Fang_Zhong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/He_Yong>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Su_Yan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Tao_Dong>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FBMEI.2012.6513169>
foaf:homepage <https://doi.org/10.1109/BMEI.2012.6513169>
dc:identifier DBLP conf/bmei/ZhongDYY12 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FBMEI.2012.6513169 (xsd:string)
dcterms:issued 2012 (xsd:gYear)
rdfs:label Low-temperature void-free wafer-level adhesive bonding for thin film transfer by nano-imprint resist. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Fang_Zhong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/He_Yong>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Su_Yan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Tao_Dong>
swrc:pages 757-760 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/bmei/2012>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/bmei/ZhongDYY12/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/bmei/ZhongDYY12>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/bmei/bmei2012.html#ZhongDYY12>
rdfs:seeAlso <https://doi.org/10.1109/BMEI.2012.6513169>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/bmei>
dc:title Low-temperature void-free wafer-level adhesive bonding for thin film transfer by nano-imprint resist. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document