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dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/case/DaiZWW22>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jiabin_Dai>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Jie_Zhang_0041>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Junliang_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lihui_Wu>
foaf:homepage <http://dx.doi.org/doi.org%2F10.1109%2FCASE49997.2022.9926610>
foaf:homepage <https://doi.org/10.1109/CASE49997.2022.9926610>
dc:identifier DBLP conf/case/DaiZWW22 (xsd:string)
dc:identifier DOI doi.org%2F10.1109%2FCASE49997.2022.9926610 (xsd:string)
dcterms:issued 2022 (xsd:gYear)
rdfs:label A Hybrid Wafer Processing Cycle Prediction Model Based on DPC-Relief-F. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jiabin_Dai>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Jie_Zhang_0041>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Junliang_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lihui_Wu>
swrc:pages 34-39 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/case/2022>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/case/DaiZWW22/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/case/DaiZWW22>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/case/case2022.html#DaiZWW22>
rdfs:seeAlso <https://doi.org/10.1109/CASE49997.2022.9926610>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/case>
dc:title A Hybrid Wafer Processing Cycle Prediction Model Based on DPC-Relief-F. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document