[RDF data]
Home | Example Publications
PropertyValue
dcterms:bibliographicCitation <http://dblp.uni-trier.de/rec/bibtex/conf/cecnet/HuYWWSWZHHH23>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Kun_Yan>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Lei_Han>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Liuwei_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Qingan_Huang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Xinlong_Zhang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yipeng_Sun>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yongfang_Hu>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Yuefei_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Ziyuan_Wang>
dc:creator <https://dblp.l3s.de/d2r/resource/authors/Zongjie_Han>
foaf:homepage <http://dx.doi.org/doi.org%2F10.3233%2FFAIA231236>
foaf:homepage <https://doi.org/10.3233/FAIA231236>
dc:identifier DBLP conf/cecnet/HuYWWSWZHHH23 (xsd:string)
dc:identifier DOI doi.org%2F10.3233%2FFAIA231236 (xsd:string)
dcterms:issued 2023 (xsd:gYear)
rdfs:label Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste. (xsd:string)
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Kun_Yan>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Lei_Han>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Liuwei_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Qingan_Huang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Xinlong_Zhang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yipeng_Sun>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yongfang_Hu>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Yuefei_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Ziyuan_Wang>
foaf:maker <https://dblp.l3s.de/d2r/resource/authors/Zongjie_Han>
swrc:pages 542-548 (xsd:string)
dcterms:partOf <https://dblp.l3s.de/d2r/resource/publications/conf/cecnet/2023>
owl:sameAs <http://bibsonomy.org/uri/bibtexkey/conf/cecnet/HuYWWSWZHHH23/dblp>
owl:sameAs <http://dblp.rkbexplorer.com/id/conf/cecnet/HuYWWSWZHHH23>
rdfs:seeAlso <http://dblp.uni-trier.de/db/conf/cecnet/cecnet2023.html#HuYWWSWZHHH23>
rdfs:seeAlso <https://doi.org/10.3233/FAIA231236>
swrc:series <https://dblp.l3s.de/d2r/resource/conferences/cecnet>
dc:title Hermetic Interlayer Interconnection Technology Based on SAC305 Solder Paste. (xsd:string)
dc:type <http://purl.org/dc/dcmitype/Text>
rdf:type swrc:InProceedings
rdf:type foaf:Document