Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. | D2R Server publishing the DBLP Bibliography Database, hosted at L3S Research Center

Property	Value
dcterms:bibliographicCitation	<http://dblp.uni-trier.de/rec/bibtex/conf/cicc/KnickerbockerPA05>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Chirag_S._Patel>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Christian_D._Schuster>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Christian_W._Baks>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Cornelia_K._Tsang>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Edmund_J._Sprogis>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Fuad_E._Doany>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Hua_Gan>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Joanna_Rosner>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/John_U._Knickerbocker>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/L._Paivikki_Buchwalter>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Paul_S._Andry>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Raymond_R._Horton>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Robert_J._Polastre>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Steven_Cordes>
dc:creator	<https://dblp.l3s.de/d2r/resource/authors/Steven_L._Wright>
foaf:homepage	<http://dx.doi.org/doi.org%2F10.1109%2FCICC.2005.1568756>
foaf:homepage	<https://doi.org/10.1109/CICC.2005.1568756>
dc:identifier	DBLP conf/cicc/KnickerbockerPA05 (xsd:string)
dc:identifier	DOI doi.org%2F10.1109%2FCICC.2005.1568756 (xsd:string)
dcterms:issued	2005 (xsd:gYear)
rdfs:label	Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. (xsd:string)
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Chirag_S._Patel>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Christian_D._Schuster>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Christian_W._Baks>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Cornelia_K._Tsang>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Edmund_J._Sprogis>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Fuad_E._Doany>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Hua_Gan>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Joanna_Rosner>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/John_U._Knickerbocker>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/L._Paivikki_Buchwalter>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Paul_S._Andry>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Raymond_R._Horton>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Robert_J._Polastre>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Steven_Cordes>
foaf:maker	<https://dblp.l3s.de/d2r/resource/authors/Steven_L._Wright>
swrc:pages	659-662 (xsd:string)
dcterms:partOf	<https://dblp.l3s.de/d2r/resource/publications/conf/cicc/2005>
owl:sameAs	<http://bibsonomy.org/uri/bibtexkey/conf/cicc/KnickerbockerPA05/dblp>
owl:sameAs	<http://dblp.rkbexplorer.com/id/conf/cicc/KnickerbockerPA05>
rdfs:seeAlso	<http://dblp.uni-trier.de/db/conf/cicc/cicc2005.html#KnickerbockerPA05>
rdfs:seeAlso	<https://doi.org/10.1109/CICC.2005.1568756>
swrc:series	<https://dblp.l3s.de/d2r/resource/conferences/cicc>
dc:title	Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. (xsd:string)
dc:type	<http://purl.org/dc/dcmitype/Text>
rdf:type	swrc:InProceedings
rdf:type	foaf:Document